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FPGA 配置 PROM

制造商	系列	封装/外壳	包装	产品状态	可编程	可编程类型	存储容量	电压 - 电源	工作温度	安装类型	供应商设备封装
Altera AMD Atmel Intel Microchip Technology Xilinx	* - EPC EPCQ EPCQ-A EPCQ-L EPCS EPCV	- 100-BQFP 16-SOIC (0.295", 7.50mm Width) 20-LCC (J-Lead) 20-SOIC (0.295", 7.50mm Width) 20-TSSOP (0.173", 4.40mm Width) 24-LBGA 24-TBGA 32-TQFP 44-LCC (J-Lead) 44-TQFP 48-TFBGA, CSPBGA 48-TFSOP (0.724", 18.40mm Width) 64-TBGA 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) 8-TDFN 88-LFBGA	Bulk Tape & Reel (TR) Tray Tube	Active Discontinued at BomKey Obsolete	- Not Verified Verified	- FLASH In System Programmable OTP Serial EEPROM	- 1.5Mb 1.6Mb 100kb 128kb 128Mb 150kb 16Mb 1Gb 1Mb 200kb 212kb 256Kb 256Mb 2Mb 300kb 32Mb 36kb 400kb 440kb 4MB 500kb 50kb 512kb 512Mb 64kb 64Mb 65kb 7Mb 8Mb	- 1.65V ~ 2V 1.7V ~ 2V 2.7V ~ 3.6V 2.97V ~ 3.63V 3.15V ~ 3.45V 3V ~ 3.6V 3V ~ 3.6V, 4.5V ~ 5.5V 3V ~ 3.6V, 4.75V ~ 5.25V 4.5V ~ 5.5V 4.75V ~ 5.25V ± 2.25V ~ 6V	- -40°C ~ 85°C -40°C ~ 85°C (TA) -55°C ~ 125°C 0°C ~ 70°C 0°C ~ 70°C (TA)	- Surface Mount Through Hole	- 100-PQFP (20x14) 16-SOIC 20-PLCC (9x9) 20-SOIC 20-TSSOP 24-FBGA (6x8) 32-TQFP (7x7) 44-PLCC (16.59x16.59) 44-PLCC (16.6x16.6) 44-TQFP (10x10) 44-VQFP (10x10) 48-CSP (8x9) 48-TSOP 64-FTBGA (10x13) 8-LAP 8-LAP (6x6) 8-PDIP 8-SOIC 8-TSOP 88-UBGA (11x8)