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    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
    RN5T568C-E4

    RN5T568C-E4

    POWER MANAGEMENT SYSTEM DEVICE F

    Nisshinbo Micro Devices Inc.

    3,729
    RN5T568C-E4

    规格书

    * - Tape & Reel (TR) Active - - - - - - - -
    RN5T568S-E4

    RN5T568S-E4

    POWER MANAGEMENT SYSTEM DEVICE F

    Nisshinbo Micro Devices Inc.

    2,297
    RN5T568S-E4

    规格书

    * - Tape & Reel (TR) Active - - - - - - - -
    MAX77659AENV+T

    MAX77659AENV+T

    SINGLE IND PMIC FOR A SWITCHING

    Analog Devices Inc./Maxim Integrated

    3,297
    MAX77659AENV+T

    规格书

    - 30-XFBGA, WLBGA Tape & Reel (TR) Active Battery Management 6µA 2.7V ~ 5.5V -40°C ~ 85°C - - Surface Mount 30-WLP (2.37x2.55)
    MC33FS4500NAER2

    MC33FS4500NAER2

    SYSTEM BASIS CHIP LINEAR 0.5A V

    NXP USA Inc.

    4,594
    MC33FS4500NAER2

    规格书

    - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
    MPF5032BMBA0ESR2

    MPF5032BMBA0ESR2

    PMIC 2 BUCKS 2 LDO A1 DIE

    NXP USA Inc.

    4,080
    MPF5032BMBA0ESR2

    规格书

    - 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
    MFS8630BMBA0ESR2

    MFS8630BMBA0ESR2

    SAFETY SYSTEM BASIS CHIP FOR DOM

    NXP USA Inc.

    1,620
    MFS8630BMBA0ESR2

    规格书

    - 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
    MPF5023AMBA0ESR2

    MPF5023AMBA0ESR2

    POWER MANAGEMENT IC, PRE-PROG, 3

    NXP USA Inc.

    2,859
    MPF5023AMBA0ESR2

    规格书

    - 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
    MPF5023CMBA0ESR2

    MPF5023CMBA0ESR2

    POWER MANAGEMENT IC, PRE-PROG, 3

    NXP USA Inc.

    4,435
    MPF5023CMBA0ESR2

    规格书

    - 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
    MD1730-I/M2

    MD1730-I/M2

    IC ULTRASOUND IMAGING 36VQFN

    Microchip Technology

    4,599
    MD1730-I/M2

    规格书

    - 36-VFQFN Exposed Pad Tray Obsolete Ultrasound Imaging - 4.75V ~ 5.25V 0°C ~ 85°C - - Surface Mount 36-SQFN (6x6)
    MP5505GL-P

    MP5505GL-P

    POWER MANAGEMENT SPECIALIZED - P

    Monolithic Power Systems Inc.

    4,690
    MP5505GL-P

    规格书

    - 20-PowerTFQFN Tape & Reel (TR) Not For New Designs Hard-Disk Drives, Solid State Drives (SSD) 2mA (Max) 2.7V ~ 7V -40°C ~ 125°C - - Surface Mount 20-QFN (3x4)
    ISL6537CRZ-T

    ISL6537CRZ-T

    IC REG/CTRLR ACPI DUAL DDR 28QFN

    Renesas Electronics Corporation

    4,653
    ISL6537CRZ-T

    规格书

    - 28-VQFN Exposed Pad Tape & Reel (TR) Active Memory, DDR/DDR2 Regulator 7mA - 0°C ~ 70°C - - Surface Mount 28-QFN (6x6)
    ISL6537CRZ-TR5160

    ISL6537CRZ-TR5160

    IC REG/CTRLR ACPI DUAL DDR 28QFN

    Renesas Electronics Corporation

    4,195
    ISL6537CRZ-TR5160

    规格书

    - 28-VQFN Exposed Pad Tape & Reel (TR) Obsolete Memory, DDR/DDR2 Regulator 7mA - 0°C ~ 70°C - - Surface Mount 28-QFN (6x6)
    SMD IC AXP223

    SMD IC AXP223

    SMD IC AXP223

    Olimex LTD

    2,017
    SMD IC AXP223

    规格书

    - - Bulk Active - - - - - - - -
    MFS8622BMBA0ESR2

    MFS8622BMBA0ESR2

    SAFETY SYSTEM BASIS CHIP FOR DOM

    NXP USA Inc.

    4,503
    MFS8622BMBA0ESR2

    规格书

    - 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
    MC33FS4505KAER2

    MC33FS4505KAER2

    SYSTEM BASIS CHIP, LINEAR 0.5A V

    NXP USA Inc.

    3,462
    MC33FS4505KAER2

    规格书

    - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MFS8621BMBA0ES

    MFS8621BMBA0ES

    IC FS86 SYSTEM BASIS CHIP ASIL

    NXP USA Inc.

    2,802
    MFS8621BMBA0ES

    规格书

    - 48-VFQFN Exposed Pad Tray Active Camera - 4.5V ~ 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7)
    BH6053GU-E2

    BH6053GU-E2

    IC PWR MGMT SW REG 32-VCSP

    Rohm Semiconductor

    2,627
    BH6053GU-E2

    规格书

    - 32-VFBGA, CSPBGA Tape & Reel (TR) Obsolete Cellular 5.7mA 3V ~ 5.5V -30°C ~ 75°C (TA) - - Surface Mount 32-VCSP85H3 (3.54x3.54)
    DA9063L-XXHO1

    DA9063L-XXHO1

    ONCE OTP IS FINALIZED, PART BECO

    Renesas Electronics Corporation

    3,726
    DA9063L-XXHO1

    规格书

    - 100-TFBGA Tray Active Processor 11mA 2.8V ~ 5.5V -40°C ~ 125°C (TJ) Automotive AEC-Q100 Surface Mount 100-TFBGA (8x8)
    ACT88321VU112SR

    ACT88321VU112SR

    ADV PMIC 3 BUCKS 2 LDOS LOAD BYP

    Qorvo

    1,752
    ACT88321VU112SR

    规格书

    ActiveCiPSTM™ 30-UFBGA, WLCSP Tape & Reel (TR) Active Solid State Drives (SSD) 260µA 2.7V ~ 5.5V -40°C ~ 125°C (TJ) - - Surface Mount 30-WLCSP (2.18x2.58)
    ACT88760-101T

    ACT88760-101T

    5V PMIC FOR NEXT GEN PROCESSORS

    Qorvo

    4,582
    ACT88760-101T

    规格书

    - 81-UFBGA, WLCSP Tape & Reel (TR) Active Processor - 2.7V ~ 5.5V - - - Surface Mount 81-WLCSP (3.78x3.78)
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