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| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 配对间距 | 位置数量 | 行数 | 行间距 - 配对 | 已加载位置数 | 样式 | 遮蔽 | 安装类型 | 端接方式 | 固定类型 | 触点长度 - 配对部分 | 触点长度 - 引脚部分 | 触点总长度 | 绝缘高度 | 触点形状 | 触点表面处理 - 配对 | 触点表面处理 - 引脚 | 触点材料 | 绝缘材料 | 特性 | 电流额定值（安培） |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DF11C-32DP-2V(57)CONN HEADER SMD 32POS 2MM |
5,744 |
|
规格书 |
DF11 | Tape & Reel (TR) | Active | Header | Male Pin | 0.079" (2.00mm) | 32 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Shrouded - 4 Wall | Surface Mount | Solder | Detent Lock | - | - | - | 0.283" (7.19mm) | Circular | Gold | - | Brass | Polyamide (PA), Nylon | Pick and Place, Solder Retention | 2A |
|
FTS-120-01-F-DVCONN HEADER SMD 40POS 1.27MM |
374 |
|
规格书 |
FTS | Tube | Active | Header, Cuttable | Male Pin | 0.050" (1.27mm) | 40 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.034" (0.86mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3.4A per Contact |
|
FTSH-120-01-F-DCONN HEADER VERT 40POS 1.27MM |
1,622 |
|
规格书 |
FTSH | Bulk | Active | Header, Cuttable | Male Pin | 0.050" (1.27mm) | 40 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.120" (3.05mm) | 0.090" (2.29mm) | 0.309" (7.86mm) | 0.099" (2.51mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3.4A per Contact |
|
IPT1-103-01-S-DCONN HEADER VERT 6POS 2.54MM |
818 |
|
规格书 |
Mini Mate® IPT1 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.155" (3.94mm) | 0.085" (2.16mm) | 0.335" (8.51mm) | 0.250" (6.35mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 2.3A per Contact |
|
87230-5CONN HEADER R/A 10POS 2.54MM |
544 |
|
规格书 |
AMPMODU Mod II | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.318" (8.08mm) | 0.110" (2.79mm) | - | 0.238" (6.05mm) | Square | Gold | Gold | Phosphor Bronze | Thermoplastic | - | 3A |
|
TLW-120-06-F-SLOW PROFILE .025 SQ STRIPS |
313 |
|
规格书 |
Flex Stack, TLW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.105" (2.67mm) | 0.135" (3.43mm) | 0.300" (7.62mm) | 0.060" (1.52mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 5.2A per Contact |
|
TSW-130-17-F-DCONN HDR T/H .025" SQUARE P |
162 |
|
规格书 |
TSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.620" (15.75mm) | 0.110" (2.79mm) | 0.830" (21.08mm) | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | - |
|
0015913023CONN HEADER SMD R/A 2POS 2.54MM |
2,252 |
|
规格书 |
SL 70634 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount, Right Angle | Solder | Latch Holder | 0.240" (6.10mm) | - | - | 0.215" (5.45mm) | Square | Gold | Tin | Phosphor Bronze | Polyester, Glass Filled | Board Guide | - |
|
T1M-03-GF-DVCONN HEADER SMD 6POS 1MM |
402 |
|
规格书 |
Micro Mate™ T1M | Bulk | Active | Header | Male Pin | 0.039" (1.00mm) | 6 | 2 | 0.077" (1.96mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount | Solder | Locking Ramp | - | - | - | 0.268" (6.80mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3.3A per Contact |
|
TSM-110-02-S-DVCONN HEADER SMD 20POS 2.54MM |
341 |
|
规格书 |
TSM | Tube | Active | Header, Cuttable | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.320" (8.13mm) | - | - | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | - |
|
2086593240IGRID 2.0 PLUGTHOLEHDR RA GF NAT |
282 |
|
规格书 |
iGrid 208659 | Tray | Active | Plug | Male Pin | 0.079" (2.00mm) | 32 | 2 | 0.079" (2.00mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Latch Lock | - | 0.126" (3.20mm) | - | 0.327" (8.30mm) | Square | Gold | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | - | Varies by Wire Gauge |
|
|
M80-8760422CONN HEADER R/A 4POS 2MM |
255 |
|
规格书 |
Datamate L-Tek | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 4 | 1 | - | All | Board to Board or Cable | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Latch Lock | - | 0.118" (3.00mm) | - | 0.156" (3.96mm) | Circular | Gold | Tin-Lead | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Strain Relief Clips | 2.2A |
|
M50-4801045CONN HEADER R/A 20POS 1.27MM |
202 |
|
规格书 |
Archer M50 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 20 | 2 | 0.050" (1.27mm) | All | Board to Board | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | - | 0.083" (2.11mm) | - | 0.222" (5.65mm) | Square | Gold | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | - | 1A per Contact |
|
N2534-6003-RBCONN HEADER VERT 34POS 2.54MM |
170 |
|
规格书 |
2500 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.243" (6.17mm) | 0.155" (3.94mm) | - | 0.390" (9.91mm) | Square | Gold | Tin | Copper Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Keying Slot | 1.75A |
|
|
0430451026CONN HEADER VERT 10POS 3MM |
1,872 |
|
规格书 |
Micro-Fit 3.0 43045 | Tray | Active | Header | Male Pin | 0.118" (3.00mm) | 10 | 2 | 0.118" (3.00mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Kinked Pin, Solder | Locking Ramp | - | 0.125" (3.18mm) | - | 0.390" (9.91mm) | Square | Gold | Tin | Brass | Liquid Crystal Polymer (LCP), Glass Filled | Board Guide, Board Lock | 8A |
|
5103311-2CONN HEADER R/A 14POS 2.54MM |
483 |
|
规格书 |
AMP-Latch | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | 0.240" (6.10mm) | 0.135" (3.43mm) | - | 0.360" (9.14mm) | Square | Gold or Gold-Palladium | Tin | Brass | - | Keying Slot | 1A per Contact |
|
FI-W21P-HFE-E1500CONN HEADER SMD R/A 21POS 1.25MM |
4,395 |
|
规格书 |
FI | Tape & Reel (TR) | Active | Receptacle | Male Pin | 0.049" (1.25mm) | 21 | 2 | 0.055" (1.40mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount, Right Angle | Solder | Friction Lock | 0.094" (2.40mm) | - | - | 0.146" (3.70mm) | Square | Gold | Tin or Tin-Alloy | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention | 1A per Contact |
|
|
TFM-115-03-L-D-WTCONN HEADER VERT 30POS 1.27MM |
2,129 |
|
规格书 |
Tiger Eye™ TFM | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 30 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.139" (3.53mm) | 0.111" (2.82mm) | - | 0.220" (5.60mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Solder Retention | 3.2A per Contact |
|
|
5-104186-1CONN HEADER R/A 4POS 1.27MM |
3,220 |
|
规格书 |
AMPMODU System 50 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.125" (3.18mm) | 0.100" (2.54mm) | - | 0.116" (2.95mm) | Circular | Gold | Tin | Copper Alloy | Thermoplastic | - | - |
|
15150242601000HAR-FLEX ANGLED MALE, 24PIN, PL1 |
447 |
|
规格书 |
har-flex® | Tape & Reel (TR) | Active | Header | Male Pin | 0.050" (1.27mm) | 24 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Shrouded - 4 Wall | Surface Mount, Right Angle | Solder | Push-Pull | - | - | - | 0.167" (4.25mm) | Square | Gold | Tin | Copper Alloy | Liquid Crystal Polymer (LCP) | Board Guide, Solder Retention | - |
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