| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 样式 | 位置数量 | 已加载位置数 | 配对间距 | 行数 | 行间距 - 配对 | 安装类型 | 端接方式 | 固定类型 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 绝缘颜色 | 绝缘高度 | 触点长度 - 引脚部分 | 工作温度 | 材料阻燃等级 | 配对堆叠高度 | 防护等级 | 特性 | 电流额定值(安培) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ESQ-116-13-G-SCONN SOCKET 16POS 0.1 GOLD PCB |
2,219 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 16 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
SSM-110-S-DVCONN RCPT 20POS 0.1 GOLD SMD |
2,900 |
|
规格书 |
Tiger Claw™ SSM | Tube | Discontinued | Receptacle, Pass Through | Female Socket | Board to Board or Cable | 20 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.290" (7.37mm) | - | -55°C ~ 125°C | - | - | - | - | 5.2A per Contact |
|
ESW-118-23-T-DCONN SOCKET 36POS 0.1 TIN PCB |
2,840 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 36 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Tin | - | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 105°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
ESQ-112-59-L-DCONN SOCKET 24POS 0.1 GOLD PCB |
4,503 |
|
规格书 |
ESQ | Bulk | Active | Elevated Socket | Forked | Board to Board | 24 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.635" (16.13mm) | 0.280" (7.11mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESW-110-13-G-D-LLCONN SOCKET 20POS 0.1 GOLD PCB |
4,996 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 20 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Kinked Pin, Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
ESW-116-23-S-SCONN SOCKET 16POS 0.1 GOLD PCB |
2,470 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 16 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
ESQ-114-33-S-SCONN SOCKET 14POS 0.1 GOLD PCB |
4,362 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 14 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-114-69-L-SCONN SOCKET 14POS 0.1 GOLD PCB |
1,402 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 14 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.735" (18.67mm) | 0.180" (4.57mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-113-48-S-S-LLCONN SOCKET 13POS 0.1 GOLD PCB |
4,925 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 13 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Kinked Pin, Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
SQW-108-01-L-D-VS-LCCONN RCPT 16POS 0.079 GOLD SMD |
3,417 |
|
规格书 |
SQW | Tube | Active | Receptacle | Forked | Board to Board or Cable | 16 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.300" (7.62mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Lock | 3.8A per Contact |
|
ESQ-108-33-S-D-LLCONN SOCKET 16POS 0.1 GOLD PCB |
1,312 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 16 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Kinked Pin, Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
SSM-114-L-DV-011-PCONN RCPT 28POS 0.1 GOLD SMD |
3,309 |
|
规格书 |
Tiger Claw™ SSM | Tube | Active | Receptacle, Pass Through | Female Socket | Board to Board or Cable | 28 | 27 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.290" (7.37mm) | - | -55°C ~ 125°C | - | - | - | Pick and Place | 5.2A per Contact |
|
HLE-108-02-G-DV-A-PCONN RCPT 16POS 0.1 GOLD SMD |
3,611 |
|
规格书 |
HLE | Tube | Active | Receptacle | Female Socket | Board to Board | 16 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Board Guide, Pick and Place | 4.1A per Contact |
|
ESQ-109-23-G-DCONN SOCKET 18POS 0.1 GOLD PCB |
3,129 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 18 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
TLE-110-01-G-DV-KCONN RCPT 20POS 0.079 GOLD SMD |
3,813 |
|
规格书 |
TLE | Tube | Active | Receptacle, Pass Through | Female Socket | Board to Board or Cable | 20 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.177" (4.50mm) | - | -55°C ~ 125°C | - | - | - | Pick and Place | 3.2A per Contact |
|
ESW-110-37-G-DCONN SOCKET 20POS 0.1 GOLD PCB |
4,678 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 20 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
ESQ-112-37-G-SCONN SOCKET 12POS 0.1 GOLD PCB |
2,952 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 12 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-127-33-T-SCONN SOCKET 27POS 0.1 TIN PCB |
3,725 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 27 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Tin | - | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 105°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESW-109-33-S-DCONN SOCKET 18POS 0.1 GOLD PCB |
4,771 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 18 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
HLE-107-02-G-DV-BE-A-KCONN RCPT 14POS 0.1 GOLD SMD |
3,680 |
|
规格书 |
HLE | Tube | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 14 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Board Guide, Pick and Place | 4.1A per Contact |