| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 样式 | 位置数量 | 已加载位置数 | 配对间距 | 行数 | 行间距 - 配对 | 安装类型 | 端接方式 | 固定类型 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 绝缘颜色 | 绝缘高度 | 触点长度 - 引脚部分 | 工作温度 | 材料阻燃等级 | 配对堆叠高度 | 防护等级 | 特性 | 电流额定值(安培) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HLE-125-02-G-DV-PE-LCCONN RCPT 50POS 0.1 GOLD PCB |
3,587 |
|
规格书 |
HLE | Tube | Active | Receptacle, Pass Through | Female Socket | Board to Board | 50 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.138" (3.50mm) | 0.090" (2.29mm) | -55°C ~ 125°C | - | - | - | Board Lock | 4.1A per Contact |
|
HLE-121-02-G-DV-BE-KCONN RCPT 42POS .100" SMD GLD |
2,800 |
|
规格书 |
HLE | Tube | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 42 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Pick and Place | 4.1A per Contact |
|
HLE-122-02-G-DV-LC-KCONN RCPT 44POS 0.1 GOLD SMD |
2,238 |
|
规格书 |
HLE | Tube | Active | Receptacle | Female Socket | Board to Board | 44 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Board Lock, Pick and Place | 4.1A per Contact |
|
HLE-120-02-G-DV-BE-A-KCONN RCPT 40POS 0.1 GOLD SMD |
1,793 |
|
规格书 |
HLE | Tube | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 40 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Board Guide, Pick and Place | 4.1A per Contact |
|
ESW-119-14-G-DCONN SOCKET 38POS 0.1 GOLD PCB |
1,251 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 38 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.480" (12.19mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
ESQ-120-12-G-D-019CONN SOCKET 40POS 0.1 GOLD PCB |
3,874 |
|
规格书 |
ESQ | Bulk | Active | Elevated Socket | Forked | Board to Board | 40 | 39 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-135-12-G-SCONN SOCKET 35POS 0.1 GOLD PCB |
2,620 |
|
规格书 |
ESQ | Bulk | Active | Elevated Socket | Forked | Board to Board | 35 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
SSQ-148-01-S-D-LLCONN RCPT 96POS 0.1 GOLD PCB |
4,480 |
|
规格书 |
SSQ | Bulk | Active | Receptacle | Forked | Board to Board or Cable | 96 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Press-Fit, Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.335" (8.51mm) | 0.104" (2.64mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
|
ESQ-115-34-S-D-LLCONN SOCKET 30POS 0.1 GOLD PCB |
1,538 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 30 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Kinked Pin, Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.635" (16.13mm) | 0.280" (7.11mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESW-132-12-F-DCONN SOCKET 64POS 0.1 GOLD PCB |
1,252 |
|
规格书 |
ESW | Bulk | Active | Elevated Socket | Forked | Board to Board | 64 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
SQT-128-01-F-D-RACONN RCPT 56P 0.079 GOLD PCB R/A |
4,645 |
|
规格书 |
SQT | Tube | Active | Receptacle | Forked | Board to Board or Cable | 56 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | Gold | Flash | Black | 0.157" (4.00mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.1A per Contact |
|
SQT-128-01-FM-D-RACONN RCPT 56P 0.079 GOLD PCB R/A |
2,470 |
|
规格书 |
SQT | Tube | Active | Receptacle | Forked | Board to Board or Cable | 56 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | Gold | Flash | Black | 0.157" (4.00mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.1A per Contact |
|
FLE-129-01-G-DV-ACONN RCPT 58POS 0.05 GOLD SMD |
1,417 |
|
规格书 |
FLE | Tube | Active | Receptacle | Female Socket | Board to Board or Cable | 58 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.172" (4.37mm) | - | -55°C ~ 125°C | - | - | - | Board Guide | 2A per Contact |
|
ESQ-130-38-G-SCONN SOCKET 30POS 0.1 GOLD PCB |
2,674 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 30 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-133-13-G-SCONN SOCKET 33POS 0.1 GOLD PCB |
4,118 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 33 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-130-33-G-SCONN SOCKET 30POS 0.1 GOLD PCB |
3,572 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 30 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESQ-136-33-S-SCONN SOCKET 36POS 0.1 GOLD PCB |
4,504 |
|
规格书 |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 36 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact |
|
ESW-132-34-T-DCONN SOCKET 64POS 0.1 TIN PCB |
2,805 |
|
规格书 |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 64 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Tin | - | Black | 0.635" (16.13mm) | 0.280" (7.11mm) | -55°C ~ 105°C | UL94 V-0 | - | - | - | 5.2A per Contact |
|
HLE-115-02-SM-DV-BE-ACONN RCPT 30POS 0.1 GOLD SMD |
3,512 |
|
规格书 |
HLE | Tube | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 30 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Board Guide | 4.1A per Contact |
|
HLE-115-02-S-DV-BE-LCCONN RCPT 30POS 0.1 GOLD SMD |
4,145 |
|
规格书 |
HLE | Tube | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 30 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | - | - | Board Lock | 4.1A per Contact |