| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 样式 | 位置数量 | 已加载位置数 | 配对间距 | 行数 | 行间距 - 配对 | 安装类型 | 端接方式 | 固定类型 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 绝缘颜色 | 绝缘高度 | 触点长度 - 引脚部分 | 工作温度 | 材料阻燃等级 | 配对堆叠高度 | 防护等级 | 特性 | 电流额定值(安培) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
YTE-144-02-L-5-7002.00 MM FLEXYZ HIGH-DENSITY ELEV |
4,295 |
|
规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 220 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.700" (17.78mm) | - | -55°C ~ 105°C | - | - | - | - | - |
|
CLT-133-02-H-D-BE-PLOW PROFILE DUAL WIPE SOCKET, 2. |
2,653 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLT-145-02-H-D-A-PLOW PROFILE DUAL WIPE SOCKET, 2. |
3,379 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLP-143-02-H-DLOW PROFILE DUAL-WIPE SOCKET, .0 |
3,937 |
|
规格书 |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 86 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |
|
CLT-142-02-H-D-BELOW PROFILE DUAL WIPE SOCKET, 2. |
4,549 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
YTE-130-02-G-Q-6302.00 MM FLEXYZ HIGH-DENSITY ELEV |
1,934 |
|
规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.630" (16.00mm) | - | -55°C ~ 105°C | - | - | - | - | - |
|
YTE-130-02-G-Q-3682.00 MM FLEXYZ HIGH-DENSITY ELEV |
3,023 |
|
规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | - | -55°C ~ 105°C | - | - | - | - | - |
|
FOLC-125-02-H-QCONN RCPT 100POS 0.05 GOLD SMD |
4,314 |
|
规格书 |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | Board to Board | 100 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.178" (4.51mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 2.6A per Contact |
|
CLT-136-02-H-D-A-KLOW PROFILE DUAL WIPE SOCKET, 2. |
3,501 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLT-141-02-H-D-BE-A-PLOW PROFILE DUAL WIPE SOCKET, 2. |
3,563 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
FOLC-140-L4-L-Q-LCCONN RCPT 160POS 0.05 GOLD PCB |
2,312 |
|
规格书 |
FOURRAY™ FOLC | Bulk | Active | Receptacle | Female Socket | Board to Board | 160 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.180" (4.57mm) | 0.120" (3.05mm) | -55°C ~ 125°C | UL94 V-0 | - | - | Board Lock | 2.6A per Contact |
|
CLH-147-H-D-DVCLH-147-H-D-DV |
3,872 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
QST-120-03-S-52.00 MM POWER PLANE SOCKET STRIP |
3,426 |
|
规格书 |
QST | Tube | Active | Receptacle | Female Socket | Board to Board | 100 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.650" (16.50mm) | 0.090" (2.29mm) | -55°C ~ 125°C | - | - | - | - | - |
|
ESD-126-G-25CONN SOCKET 52POS 0.1 GOLD PCB |
4,512 |
|
规格书 |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 52 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.500" (12.70mm) | 0.165" (4.19mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
|
YTQ-140-03-S-Q2.00 MM FLEXYZ HIGH-DENSITY SQUA |
3,283 |
|
规格书 |
YTQ | Tube | Active | Socket | Forked | Board to Board | 160 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.250" (6.35mm) | 0.208" (5.28mm) | -55°C ~ 125°C | - | - | - | - | - |
|
ESD-132-G-03CONN SOCKET 64POS 0.1 GOLD PCB |
1,878 |
|
规格书 |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 64 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.300" (7.62mm) | 0.153" (3.89mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
|
YTE-138-03-M-Q-3402.00 MM FLEXYZ HIGH-DENSITY ELEV |
2,545 |
|
规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 152 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.340" (8.64mm) | - | -55°C ~ 105°C | - | - | - | - | - |
|
CLT-146-02-SM-D-A-PLOW PROFILE DUAL WIPE SOCKET, 2. |
2,089 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1446300000CONN RCPT 36POS 0.197 TIN PCB |
1,810 |
|
规格书 |
Omnimate RSV | Bulk | Active | Receptacle | Female Socket | Board to Board or Cable | 36 | All | 0.197" (5.00mm) | 4 | 0.197" (5.00mm) | Through Hole | Solder | Latch Holder | Tin | - | Gray | 0.563" (14.30mm) | 0.126" (3.20mm) | -20°C ~ 120°C | UL94 V-0 | - | - | - | - |
|
1446700000CONN RCPT 36POS 0.197 TIN PCB |
1,786 |
|
规格书 |
Omnimate RSV | Bulk | Active | Receptacle | Female Socket | Board to Board or Cable | 36 | All | 0.197" (5.00mm) | 4 | 0.197" (5.00mm) | Through Hole | Solder | Latch Holder | Tin | - | Gray | 0.563" (14.30mm) | 0.126" (3.20mm) | -20°C ~ 120°C | UL94 V-0 | - | - | Mounting Flange | - |