| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 样式 | 位置数量 | 已加载位置数 | 配对间距 | 行数 | 行间距 - 配对 | 安装类型 | 端接方式 | 固定类型 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 绝缘颜色 | 绝缘高度 | 触点长度 - 引脚部分 | 工作温度 | 材料阻燃等级 | 配对堆叠高度 | 防护等级 | 特性 | 电流额定值(安培) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BLM LG 2 20 Zpitch 1.27 x 2.54 mm; suitable f |
4,999 |
|
规格书 |
BLM LG 2 | Bulk | Active | Header | Forked | - | 20 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | 0.201" (5.10mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM KG 2 34 Zpitch 1.27 x 2.54 mm; suitable f |
4,829 |
|
规格书 |
BLM KG 2 | Bulk | Active | Header | Forked | - | 34 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | 0.118" (3.00mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BL 3 3 ZStamped contact spring (fork con |
4,145 |
|
规格书 |
BL 3 | Bulk | Active | Header | Forked | - | 3 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.315" (8.00mm) | 0.138" (3.50mm) | -40°C ~ 200°C | UL94 V-0 | - | - | - | 3A |
|
BLM LG 1 13 Gsuitable for male header SLM and |
1,239 |
|
规格书 |
BLM LG 1 | Bulk | Active | Header | Forked | - | 13 | All | 0.050" (1.27mm) | 1 | - | Through Hole | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | 0.201" (5.10mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 1 SMD 17 Zwide isolation body - suitable f |
4,762 |
|
规格书 |
BLM 1 SMD | Bulk | Active | Header | Forked | - | 17 | All | 0.050" (1.27mm) | 1 | - | Surface Mount | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 2 SMD 12 Gpitch 1.27 x 2.54 mm; suitable f |
3,092 |
|
规格书 |
BLM 2 SMD | Bulk | Active | Header | Forked | - | 12 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM LG 1 36 Gsuitable for male header SLM and |
4,176 |
|
规格书 |
BLM LG 1 | Bulk | Active | Header | Forked | - | 36 | All | 0.050" (1.27mm) | 1 | - | Through Hole | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | 0.201" (5.10mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 3 SMD 17 Zexpanded insulator - suitable fo |
2,602 |
|
规格书 |
BLM 3 SMD | Bulk | Active | Header | Forked | - | 17 | All | 0.050" (1.27mm) | 1 | - | Surface Mount | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | 0.197" (5.00mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 2 SMD 22 Zpitch 1.27 x 2.54 mm; suitable f |
3,485 |
|
规格书 |
BLM 2 SMD | Bulk | Active | Header | Forked | - | 22 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 2 SMD 34 Zpitch 1.27 x 2.54 mm; suitable f |
4,617 |
|
规格书 |
BLM 2 SMD | Bulk | Active | Header | Forked | - | 34 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 3 SMD 2 Gexpanded insulator - suitable fo |
3,632 |
|
规格书 |
BLM 3 SMD | Bulk | Active | Header | Forked | - | 2 | All | 0.050" (1.27mm) | 1 | - | Surface Mount | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | 0.197" (5.00mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BL 2 68 ZStamped contact spring (fork con |
3,308 |
|
规格书 |
BL 2 | Bulk | Active | Header | Forked | - | 68 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.315" (8.00mm) | 0.130" (3.30mm) | -40°C ~ 200°C | UL94 V-0 | - | - | - | 3A |
|
BLM LG 1 33 Zsuitable for male header SLM and |
4,645 |
|
规格书 |
BLM LG 1 | Bulk | Active | Header | Forked | - | 33 | All | 0.050" (1.27mm) | 1 | - | Through Hole | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | 0.201" (5.10mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 1 SMD 5 Gwide isolation body - suitable f |
4,303 |
|
规格书 |
BLM 1 SMD | Bulk | Active | Header | Forked | - | 5 | All | 0.050" (1.27mm) | 1 | - | Surface Mount | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM KG 2 48 Gpitch 1.27 x 2.54 mm; suitable f |
2,578 |
|
规格书 |
BLM KG 2 | Bulk | Active | Header | Forked | - | 48 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | 0.118" (3.00mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM KG 1 4 Zsuitable for male header SLM and |
2,984 |
|
规格书 |
BLM KG 1 | Bulk | Active | Header | Forked | - | 4 | All | 0.050" (1.27mm) | 1 | - | Through Hole | Solder | - | Tin | 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) | - | 0.335" (8.50mm) | 0.118" (3.00mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM 1 SMD 12 Gwide isolation body - suitable f |
2,185 |
|
规格书 |
BLM 1 SMD | Bulk | Active | Header | Forked | - | 12 | All | 0.050" (1.27mm) | 1 | - | Surface Mount | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BL 1 14 GStamped contact spring (fork con |
4,972 |
|
规格书 |
BL 1 | Bulk | Active | Header | Forked | - | 14 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.315" (8.00mm) | 0.130" (3.30mm) | -40°C ~ 200°C | UL94 V-0 | - | - | - | 3A |
|
BLM 2 SMD 10 Gpitch 1.27 x 2.54 mm; suitable f |
1,309 |
|
规格书 |
BLM 2 SMD | Bulk | Active | Header | Forked | - | 10 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | - | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |
|
BLM LG 1 9 Gsuitable for male header SLM and |
2,627 |
|
规格书 |
BLM LG 1 | Bulk | Active | Header | Forked | - | 9 | All | 0.050" (1.27mm) | 1 | - | Through Hole | Solder | - | Gold | 7.87µin (0.200µm) | - | 0.335" (8.50mm) | 0.201" (5.10mm) | -40°C ~ 163°C | UL94 V-0 | - | - | - | 1.5A |