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    RFI 和 EMI - 接触件、弹性条和垫圈

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度
    4186PA51H00100

    4186PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,792
    4186PA51H00100

    规格书

    51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 1.000" (25.40mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    10117780-001LF

    10117780-001LF

    RFI FINGERSTOCK CU GOLD SOLDER

    Amphenol ICC (FCI)

    2,507
    10117780-001LF

    规格书

    - Tape & Reel (TR) Active Fingerstock - 0.236" (6.00mm) 0.268" (6.80mm) 0.083" (2.10mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
    4052AC51H00071

    4052AC51H00071

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    4,159
    4052AC51H00071

    规格书

    51H Bulk Active Fabric Over Foam D-Shape 0.079" (2.00mm) 0.710" (18.03mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    10121135-001LF

    10121135-001LF

    RFI FINGERSTOCK CU GOLD SOLDER

    Amphenol ICC (FCI)

    4,276
    10121135-001LF

    规格书

    - Tube Obsolete Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.138" (3.50mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
    4520PA51G00100

    4520PA51G00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,903
    4520PA51G00100

    规格书

    51G Bulk Active Fabric Over Foam Square 0.080" (2.03mm) 1.000" (25.40mm) 0.080" (2.03mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
    120220-0313

    120220-0313

    RFI SHD FINGER TITAN CU NICK SLD

    ITT Cannon, LLC

    1,689
    120220-0313

    规格书

    - Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.147" (3.73mm) 0.118" (3.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
    67SLA060080070PI00

    67SLA060080070PI00

    SLA W6XH8XL7MM

    Laird Technologies EMI

    3,734
    67SLA060080070PI00

    规格书

    SMD Contact Bulk Obsolete - - - - - - - - - -
    120220-0315

    120220-0315

    RFI SHD FINGER TITAN CU NICK SLD

    ITT Cannon, LLC

    4,605
    120220-0315

    规格书

    - Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.157" (3.99mm) 0.157" (4.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
    1-1447360-1

    1-1447360-1

    RFI SHLD FINGER CU GOLD SOLDER

    TE Connectivity AMP Connectors

    2,823
    1-1447360-1

    规格书

    - Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.039" (1.00mm) 0.138" (3.50mm) 0.055" (1.40mm) Copper Alloy Gold 1.967µin (0.05µm) Solder -
    1554825-1

    1554825-1

    RFI SHLD FINGER CU GOLD SOLDER

    TE Connectivity AMP Connectors

    3,301
    1554825-1

    规格书

    - Bag Active Shield Finger, Pre-Loaded - 0.045" (1.15mm) 0.094" (2.40mm) 0.051" (1.30mm) Copper Alloy Gold Flash Solder -
    BMI-C-001-SN

    BMI-C-001-SN

    RFI SHLD FINGER BECU TIN SOLDER

    Laird Technologies EMI

    3,034
    BMI-C-001-SN

    规格书

    BMI-C Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.122" (3.11mm) 0.096" (2.44mm) Beryllium Copper Tin - Solder -
    10103958-001LF

    10103958-001LF

    RFI FINGERSTOCK CU TIN

    Amphenol ICC (FCI)

    4,270
    10103958-001LF

    规格书

    - Tape & Reel (TR) Active Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.132" (3.35mm) Copper Alloy Tin 30.0µin (0.76µm) - -
    4912PA51H00100

    4912PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,248
    4912PA51H00100

    规格书

    51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    67BCG2504303510R00

    67BCG2504303510R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    2,429
    67BCG2504303510R00

    规格书

    BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
    4157PA51H00100

    4157PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    1,404
    4157PA51H00100

    规格书

    ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    SMG118157R-0.197

    SMG118157R-0.197

    RFI FILM OVER FOAM PU

    Leader Tech Inc.

    2,734
    SMG118157R-0.197

    规格书

    - Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.157" (4.00mm) 0.197" (5.00mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
    SMG256197R-0.118

    SMG256197R-0.118

    RFI FILM OVER FOAM PU

    Leader Tech Inc.

    4,456
    SMG256197R-0.118

    规格书

    - Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.197" (5.00mm) 0.256" (6.50mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
    67BCG2003201508R00

    67BCG2003201508R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    1,079
    67BCG2003201508R00

    规格书

    BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
    10116189-001LF

    10116189-001LF

    RFI FINGERSTOCK CU GOLD

    Amphenol ICC (FCI)

    3,029
    10116189-001LF

    规格书

    - Tape & Reel (TR) Active Fingerstock - - - - Copper Alloy Gold 3.00µin (0.076µm) - -
    67B5N4004005108R00

    67B5N4004005108R00

    SP,CON,TNR 5.10X4.00X4.00MM

    Laird Technologies EMI

    2,909
    67B5N4004005108R00

    规格书

    - Cut Tape (CT) Active - - - - - - - - - -
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