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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-87-304-41-004101

    116-87-304-41-004101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,453
    116-87-304-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-312-41-117101

    114-87-312-41-117101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,669
    114-87-312-41-117101

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-312-41-134161

    114-87-312-41-134161

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,988
    114-87-312-41-134161

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-33/Z-T

    AW 127-33/Z-T

    SOCKET 34 CONTACTS SINGLE ROW

    Assmann WSW Components

    1,932
    AW 127-33/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    116-87-306-41-008101

    116-87-306-41-008101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    1,697
    116-87-306-41-008101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-306-41-035101

    146-87-306-41-035101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    1,691
    146-87-306-41-035101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-306-41-036101

    146-87-306-41-036101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,361
    146-87-306-41-036101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-308-41-005101

    110-83-308-41-005101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    1,736
    110-83-308-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-308-41-605101

    110-83-308-41-605101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,596
    110-83-308-41-605101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-306-41-006101

    116-83-306-41-006101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,772
    116-83-306-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-314-10-001101

    110-87-314-10-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    1,073
    110-87-314-10-001101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS20-G

    A-CCS20-G

    CONN SOCKET PLCC 20POS GOLD

    Assmann WSW Components

    2,050
    A-CCS20-G

    规格书

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    110-83-306-41-105161

    110-83-306-41-105161

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,030
    110-83-306-41-105161

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-306-31-012101

    614-83-306-31-012101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,003
    614-83-306-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-308-41-003101

    115-83-308-41-003101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,923
    115-83-308-41-003101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-210-41-105101

    110-87-210-41-105101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,609
    110-87-210-41-105101

    规格书

    110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-310-41-001101

    614-87-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,276
    614-87-310-41-001101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-31/Z-T

    AW 127-31/Z-T

    SOCKET 31 CONTACTS SINGLE ROW

    Assmann WSW Components

    2,555
    AW 127-31/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    A-CCS84-Z-SM

    A-CCS84-Z-SM

    CONN SOCKET PLCC 84POS TIN

    Assmann WSW Components

    1,946
    A-CCS84-Z-SM

    规格书

    - Bag Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    HLS-0301-TT-12

    HLS-0301-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,066
    HLS-0301-TT-12

    规格书

    HLS Tube Active SIP 3 (3 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
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