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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    123-87-308-41-001101

    123-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,226
    123-87-308-41-001101

    规格书

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-316-41-605101

    110-87-316-41-605101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,979
    110-87-316-41-605101

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-610-41-005101

    110-83-610-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,217
    110-83-610-41-005101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    03-0513-10H

    03-0513-10H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,148
    03-0513-10H

    规格书

    0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-314-41-001101

    115-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    1,090
    115-87-314-41-001101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ED028PLCZ-SM-N

    ED028PLCZ-SM-N

    CONN SOCKET PLCC 28POS

    On Shore Technology Inc.

    4,006
    ED028PLCZ-SM-N

    规格书

    ED Tube Active PLCC 28 (2 x 14) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
    822499-1

    822499-1

    CONN SOCKET PLCC 44POS TIN-LEAD

    TE Connectivity AMP Connectors

    3,762
    822499-1

    规格书

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Thermoplastic -
    AR 36-HGL-TT

    AR 36-HGL-TT

    SOCKET

    Assmann WSW Components

    1,791
    AR 36-HGL-TT

    规格书

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    DIP328-011B

    DIP328-011B

    DIP328-011B-DIP SOCKET 28 CTS

    Amphenol ICC (FCI)

    4,671
    DIP328-011B

    规格书

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR 52-HZL-TT

    AR 52-HZL-TT

    SOCKET

    Assmann WSW Components

    4,982
    AR 52-HZL-TT

    规格书

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    03-0518-11H

    03-0518-11H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    1,896
    03-0518-11H

    规格书

    518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0518-10T

    07-0518-10T

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    1,535
    07-0518-10T

    规格书

    518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-10

    08-1518-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,989
    08-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    A40-LCG

    A40-LCG

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    3,340
    A40-LCG

    规格书

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    116-83-306-41-012101

    116-83-306-41-012101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,735
    116-83-306-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-210-31-012101

    614-87-210-31-012101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,655
    614-87-210-31-012101

    规格书

    614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-310-31-012101

    614-87-310-31-012101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,071
    614-87-310-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-2

    HLS-0102-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,390
    HLS-0102-G-2

    规格书

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    612-83-308-41-001101

    612-83-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    1,737
    612-83-308-41-001101

    规格书

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-39/Z-T

    AW 127-39/Z-T

    SOCKET 39 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,517
    AW 127-39/Z-T

    规格书

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