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| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-1571551-3CONN IC DIP SOCKET 14POS GOLD |
2,700 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
AR20-HZL/07-TTCONN IC DIP SOCKET 20POS GOLD |
4,759 |
|
规格书 |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
08-2513-10TCONN IC DIP SOCKET 8POS GOLD |
2,696 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
08-4513-10TCONN IC DIP SOCKET 8POS GOLD |
2,201 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
04-0518-11HCONN SOCKET SIP 4POS GOLD |
1,921 |
|
规格书 |
518 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
04-1518-11HCONN IC DIP SOCKET 4POS GOLD |
2,000 |
|
规格书 |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
09-0518-10HCONN SOCKET SIP 9POS GOLD |
3,239 |
|
规格书 |
518 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
HLS-0104-TT-12.100" SCREW MACHINE SOCKET ARRAY |
1,197 |
|
规格书 |
HLS | Tube | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | -55°C ~ 140°C |
|
540-99-032-17-400000CONN SOCKET PLCC 32POS TIN-LEAD |
3,268 |
|
规格书 |
540 | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
110-87-422-41-005101CONN IC DIP SOCKET 22POS GOLD |
3,748 |
|
规格书 |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-422-41-605101CONN IC DIP SOCKET 22POS GOLD |
3,935 |
|
规格书 |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
ED052PLCZ-SM-NCONN SOCKET PLCC 52POS |
3,435 |
|
规格书 |
ED | Tube | Active | PLCC | 52 (2 x 26) | 0.050" (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -55°C ~ 105°C |
|
612-83-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
4,367 |
|
规格书 |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
A-CCS 052-Z-SMCONN SOCKET PLCC 52POS TIN |
2,532 |
|
规格书 |
- | Tube | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled | -40°C ~ 105°C |
|
|
SIP050-1X12-160B1X12-160B-SIP SOCKET 12 CTS |
2,560 |
|
规格书 |
SIP050-1x | Bulk | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
540-99-020-17-400000CONN SOCKET PLCC 20POS TIN-LEAD |
4,204 |
|
规格书 |
540 | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
|
540-99-020-17-400200CONN SOCKET PLCC 20POS TIN-LEAD |
4,343 |
|
规格书 |
540 | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
115-87-318-41-003101CONN IC DIP SOCKET 18POS GOLD |
4,100 |
|
规格书 |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
0787250002CONN CAMERA SOCKET 18POS GOLD |
2,472 |
|
规格书 |
78725 | Tray | Obsolete | Camera Socket | 18 (2 x 9) | - | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | - | Gold | Flash | Copper Alloy | Thermoplastic | -30°C ~ 85°C |
|
|
110-87-324-41-001151CONN IC DIP SOCKET 24POS GOLD |
3,059 |
|
规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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