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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-83-318-41-605101

    110-83-318-41-605101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,513
    110-83-318-41-605101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-310-41-001101

    121-83-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,834
    121-83-310-41-001101

    规格书

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    130-024-050

    130-024-050

    CONN IC DIP SOCKET 24POS GOLD

    3M

    4,633
    130-024-050

    规格书

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    110-83-320-41-001151

    110-83-320-41-001151

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,664
    110-83-320-41-001151

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-314-41-134191

    114-83-314-41-134191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,422
    114-83-314-41-134191

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0513-11

    05-0513-11

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,117
    05-0513-11

    规格书

    0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP050-1X16-160B

    SIP050-1X16-160B

    1X16-160B-SIP SOCKET 16 CTS

    Amphenol ICC (FCI)

    1,318
    SIP050-1X16-160B

    规格书

    SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    917-87-108-41-053101

    917-87-108-41-053101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    4,242
    917-87-108-41-053101

    规格书

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-87-208-41-053101

    917-87-208-41-053101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    4,255
    917-87-208-41-053101

    规格书

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 64-HGL-TT

    AR 64-HGL-TT

    SOCKET

    Assmann WSW Components

    3,549
    AR 64-HGL-TT

    规格书

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    814-AG11D-ES

    814-AG11D-ES

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,980
    814-AG11D-ES

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    410-83-216-10-001101

    410-83-216-10-001101

    CONN ZIG-ZAG 16POS GOLD

    Preci-Dip

    4,256
    410-83-216-10-001101

    规格书

    410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-216-10-002101

    410-83-216-10-002101

    CONN ZIG-ZAG 16POS GOLD

    Preci-Dip

    4,341
    410-83-216-10-002101

    规格书

    410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0513-10

    11-0513-10

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,938
    11-0513-10

    规格书

    0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0513-10T

    12-0513-10T

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    1,665
    12-0513-10T

    规格书

    0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0503-21

    02-0503-21

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,512
    02-0503-21

    规格书

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    02-0503-31

    02-0503-31

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,565
    02-0503-31

    规格书

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    06-0518-11H

    06-0518-11H

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,288
    06-0518-11H

    规格书

    518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-1518-11H

    06-1518-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,748
    06-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10H

    13-0518-10H

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,877
    13-0518-10H

    规格书

    518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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