您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-83-316-41-012101

    116-83-316-41-012101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,592
    116-83-316-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0513-10T

    18-0513-10T

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,400
    18-0513-10T

    规格书

    0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0503-21

    03-0503-21

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,223
    03-0503-21

    规格书

    0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    03-0503-31

    03-0503-31

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,917
    03-0503-31

    规格书

    0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-4518-10T

    22-4518-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    1,917
    22-4518-10T

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    212-1-14-003

    212-1-14-003

    CONN IC DIP SOCKET 14POS GOLD

    CNC Tech

    1,833
    212-1-14-003

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    HLS-0203-T-10

    HLS-0203-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,413
    HLS-0203-T-10

    规格书

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-83-628-41-001101

    110-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,567
    110-83-628-41-001101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-628-41-001151

    110-83-628-41-001151

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,599
    110-83-628-41-001151

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-822473-7

    1-822473-7

    CONN SOCKET PLCC 84POS TIN

    TE Connectivity AMP Connectors

    4,292
    1-822473-7

    规格书

    - Box Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    400-028-050

    400-028-050

    CONN IC DIP SOCKET 28POS GOLD

    3M

    1,663
    400-028-050

    规格书

    400 Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    06-6513-11

    06-6513-11

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,440
    06-6513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0518-11

    12-0518-11

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,210
    12-0518-11

    规格书

    518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-11

    12-1518-11

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    2,731
    12-1518-11

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    D0924-42

    D0924-42

    CONN IC DIP SOCKET 24POS GOLD

    Harwin Inc.

    2,027
    D0924-42

    规格书

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    822-AG11D-ESL-LF

    822-AG11D-ESL-LF

    CONN IC DIP SOCKET 22POS GOLD

    TE Connectivity AMP Connectors

    4,943
    822-AG11D-ESL-LF

    规格书

    800 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-87-316-41-001101

    116-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,634
    116-87-316-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-310-41-004101

    116-83-310-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,340
    116-83-310-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-ICS-254-14-TT50

    A-ICS-254-14-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    3,800
    A-ICS-254-14-TT50

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-87-322-41-012101

    116-87-322-41-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,981
    116-87-322-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城