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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    117-87-430-41-105101

    117-87-430-41-105101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    1,340
    117-87-430-41-105101

    规格书

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D2864-42

    D2864-42

    CONN IC DIP SOCKET 64POS GOLD

    Harwin Inc.

    1,280
    D2864-42

    规格书

    D2 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    HLS-0208-TT-22

    HLS-0208-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,382
    HLS-0208-TT-22

    规格书

    HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    510-87-073-11-061101

    510-87-073-11-061101

    CONN SOCKET PGA 73POS GOLD

    Preci-Dip

    2,072
    510-87-073-11-061101

    规格书

    510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-316-41-004101

    116-87-316-41-004101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,211
    116-87-316-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    BU200Z-178-HT

    BU200Z-178-HT

    CONN IC DIP SOCKET 20POS GOLD

    On Shore Technology Inc.

    2,841
    BU200Z-178-HT

    规格书

    BU-178HT Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    146-87-424-41-036101

    146-87-424-41-036101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,571
    146-87-424-41-036101

    规格书

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-STL-O-TR

    ICF-320-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,335
    ICF-320-STL-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-320-STL-I-TR

    ICF-320-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,960
    ICF-320-STL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    122-87-324-41-001101

    122-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,796
    122-87-324-41-001101

    规格书

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-624-41-035101

    146-87-624-41-035101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,102
    146-87-624-41-035101

    规格书

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-624-41-036101

    146-87-624-41-036101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,120
    146-87-624-41-036101

    规格书

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-044-08-031101

    510-83-044-08-031101

    CONN SOCKET PGA 44POS GOLD

    Preci-Dip

    1,296
    510-83-044-08-031101

    规格书

    510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-632-31-012101

    614-87-632-31-012101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,118
    614-87-632-31-012101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-4513-11H

    08-4513-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,705
    08-4513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6513-10T

    20-6513-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,171
    20-6513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0518-11

    21-0518-11

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,742
    21-0518-11

    规格书

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-422-STT

    ICA-422-STT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,195
    ICA-422-STT

    规格书

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-422-STT

    ICO-422-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,752
    ICO-422-STT

    规格书

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-322-STT

    ICO-322-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,173
    ICO-322-STT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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