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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    C9122-00

    C9122-00

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,742
    C9122-00

    规格书

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0116-T-2

    HLS-0116-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,720
    HLS-0116-T-2

    规格书

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-320-11-001101

    299-87-320-11-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,373
    299-87-320-11-001101

    规格书

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    IC-628-SGT

    IC-628-SGT

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    2,707
    IC-628-SGT

    规格书

    IC Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
    510-83-073-11-061101

    510-83-073-11-061101

    CONN SOCKET PGA 73POS GOLD

    Preci-Dip

    3,414
    510-83-073-11-061101

    规格书

    510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-009101

    116-83-628-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,950
    116-83-628-41-009101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-2501-20

    08-2501-20

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,508
    08-2501-20

    规格书

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-424-41-011101

    116-83-424-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,693
    116-83-424-41-011101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZSGT

    ICA-318-ZSGT

    CONN IC DIP SOCKET 18POS GOLD

    Samtec Inc.

    1,941
    ICA-318-ZSGT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZSGT

    ICO-318-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,628
    ICO-318-ZSGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    08-0501-20

    08-0501-20

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    3,315
    08-0501-20

    规格书

    501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-0501-30

    08-0501-30

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    4,691
    08-0501-30

    规格书

    501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-318-41-013101

    116-87-318-41-013101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,509
    116-87-318-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-F-O

    ICF-320-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,475
    ICF-320-F-O

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-121-15-001101

    510-87-121-15-001101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    2,849
    510-87-121-15-001101

    规格书

    510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-121-15-061101

    510-87-121-15-061101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    2,820
    510-87-121-15-061101

    规格书

    510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-011101

    116-87-328-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,553
    116-87-328-41-011101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0503-21

    05-0503-21

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    1,304
    05-0503-21

    规格书

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-4518-10H

    20-4518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,864
    20-4518-10H

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0109-G-10

    HLS-0109-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,408
    HLS-0109-G-10

    规格书

    HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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