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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    04-7533-10

    04-7533-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    1,054
    04-7533-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7550-10

    04-7550-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    1,382
    04-7550-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7560-10

    04-7560-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    2,746
    04-7560-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7700-10

    04-7700-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    4,587
    04-7700-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7755-10

    04-7755-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    1,698
    04-7755-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7800-10

    04-7800-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    1,728
    04-7800-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7850-10

    04-7850-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    2,548
    04-7850-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7950-10

    04-7950-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    2,557
    04-7950-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    115-83-952-41-001101

    115-83-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,141
    115-83-952-41-001101

    规格书

    115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0303-G-11

    HLS-0303-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,036
    HLS-0303-G-11

    规格书

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    22-16-2

    22-16-2

    CONN SOCKET TRANSIST 3POS GOLD

    Grayhill Inc.

    2,755
    22-16-2

    规格书

    22 Bulk Obsolete Transistor 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Thermoplastic, Glass Filled -
    22-16-3

    22-16-3

    CONN SOCKET TRANSIST 3POS GOLD

    Grayhill Inc.

    4,667
    22-16-3

    规格书

    22 Bulk Obsolete Transistor 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Thermoplastic, Glass Filled -
    510-83-081-09-000101

    510-83-081-09-000101

    CONN SOCKET PGA 81POS GOLD

    Preci-Dip

    2,071
    510-83-081-09-000101

    规格书

    510 Bulk Active PGA 81 (9 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-081-12-071101

    510-83-081-12-071101

    CONN SOCKET PGA 81POS GOLD

    Preci-Dip

    3,357
    510-83-081-12-071101

    规格书

    510 Bulk Active PGA 81 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-640-41-105101

    117-83-640-41-105101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    1,570
    117-83-640-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    524-AG10D-ES

    524-AG10D-ES

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    4,779
    524-AG10D-ES

    规格书

    500 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    ICO-322-SST

    ICO-322-SST

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,185
    ICO-322-SST

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    146-83-432-41-035101

    146-83-432-41-035101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,591
    146-83-432-41-035101

    规格书

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-6513-10

    40-6513-10

    40 POS LOW PROF SOCK SERIES 513

    Aries Electronics

    2,400
    40-6513-10

    规格书

    513 - Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-C195-11

    14-C195-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,227
    14-C195-11

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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