您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    32-3513-10

    32-3513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,762
    32-3513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-084-10-001101

    510-83-084-10-001101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,571
    510-83-084-10-001101

    规格书

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-10-031101

    510-83-084-10-031101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    1,568
    510-83-084-10-031101

    规格书

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-002101

    510-83-084-11-002101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    1,129
    510-83-084-11-002101

    规格书

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-041101

    510-83-084-11-041101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,942
    510-83-084-11-041101

    规格书

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-042101

    510-83-084-11-042101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,323
    510-83-084-11-042101

    规格书

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-12-051101

    510-83-084-12-051101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,787
    510-83-084-12-051101

    规格书

    510 Bulk Active PGA 84 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6503-30

    10-6503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,970
    10-6503-30

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    124-83-628-41-002101

    124-83-628-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,489
    124-83-628-41-002101

    规格书

    124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    816-AG10D

    816-AG10D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,536
    816-AG10D

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-83-084-13-081101

    510-83-084-13-081101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,214
    510-83-084-13-081101

    规格书

    510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-13-082101

    510-83-084-13-082101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    1,462
    510-83-084-13-082101

    规格书

    510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-950-41-001101

    614-83-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,667
    614-83-950-41-001101

    规格书

    614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    36-1518-11

    36-1518-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    1,950
    36-1518-11

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-322-TL-I-TR

    ICF-322-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,751
    ICF-322-TL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-I-TR

    ICF-322-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,906
    ICF-322-STL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-O-TR

    ICF-322-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,276
    ICF-322-STL-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APH-0504-T-R

    APH-0504-T-R

    APH-0504-T-R

    Samtec Inc.

    4,665
    APH-0504-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1404-T-R

    APH-1404-T-R

    APH-1404-T-R

    Samtec Inc.

    2,495
    APH-1404-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1004-T-R

    APH-1004-T-R

    APH-1004-T-R

    Samtec Inc.

    1,481
    APH-1004-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城