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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    510-87-145-15-081101

    510-87-145-15-081101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    2,138
    510-87-145-15-081101

    规格书

    510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0503-T-2

    HLS-0503-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,062
    HLS-0503-T-2

    规格书

    HLS Bulk Active SIP 15 (5 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-324-10-001101

    299-87-324-10-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,895
    299-87-324-10-001101

    规格书

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-LGT

    ICO-318-LGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,290
    ICO-318-LGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    916657-3

    916657-3

    CONN SOCKET PGA ZIF 321POS GOLD

    TE Connectivity AMP Connectors

    1,767
    916657-3

    规格书

    - Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    146-87-642-41-035101

    146-87-642-41-035101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,963
    146-87-642-41-035101

    规格书

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0113-G-2

    HLS-0113-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,515
    HLS-0113-G-2

    规格书

    HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-316-SM-O

    ICF-316-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,685
    ICF-316-SM-O

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICA-422-ZWTT

    ICA-422-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,881
    ICA-422-ZWTT

    规格书

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    4726

    4726

    SMT SOCKET - WIDE SOIC-8 (200MIL

    Adafruit Industries LLC

    2,351
    4726

    规格书

    - Bulk Active SOIC 8 (2 x 4) 0.050" (1.27mm) - - - Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - - -
    HLS-0106-G-3

    HLS-0106-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,112
    HLS-0106-G-3

    规格书

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-3503-20

    12-3503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,506
    12-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-3503-30

    12-3503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,196
    12-3503-30

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3518-101

    20-3518-101

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,461
    20-3518-101

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-6513-10T

    40-6513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,720
    40-6513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3513-11H

    14-3513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,215
    14-3513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-964-41-005101

    110-83-964-41-005101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    4,917
    110-83-964-41-005101

    规格书

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-640-T-I-TR

    ICF-640-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,938
    ICF-640-T-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-432-41-001101

    116-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,941
    116-83-432-41-001101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-146-15-061101

    510-87-146-15-061101

    CONN SOCKET PGA 146POS GOLD

    Preci-Dip

    4,892
    510-87-146-15-061101

    规格书

    510 Bulk Active PGA 146 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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