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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    HLS-0304-G-11

    HLS-0304-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,407
    HLS-0304-G-11

    规格书

    HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0205-G-12

    HLS-0205-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,457
    HLS-0205-G-12

    规格书

    HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0112-T-32

    HLS-0112-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,065
    HLS-0112-T-32

    规格书

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-642-41-001101

    116-87-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,953
    116-87-642-41-001101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3503-20

    14-3503-20

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,571
    14-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3503-30

    14-3503-30

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,997
    14-3503-30

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-316-WGT

    ICA-316-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,273
    ICA-316-WGT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-ZAGT

    ICO-316-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,372
    ICO-316-ZAGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    124-83-428-41-002101

    124-83-428-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,042
    124-83-428-41-002101

    规格书

    124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-ZWGG

    ICA-308-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,097
    ICA-308-ZWGG

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-83-650-31-012101

    614-83-650-31-012101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,358
    614-83-650-31-012101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-642-41-007101

    116-87-642-41-007101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,498
    116-87-642-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6513-10T

    48-6513-10T

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,418
    48-6513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    117-87-664-41-105101

    117-87-664-41-105101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    1,597
    117-87-664-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-6518-102

    24-6518-102

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,730
    24-6518-102

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-155-16-003101

    510-87-155-16-003101

    CONN SOCKET PGA 155POS GOLD

    Preci-Dip

    1,860
    510-87-155-16-003101

    规格书

    510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-155-16-093101

    510-87-155-16-093101

    CONN SOCKET PGA 155POS GOLD

    Preci-Dip

    2,112
    510-87-155-16-093101

    规格书

    510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-83-616-10-002101

    299-83-616-10-002101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,978
    299-83-616-10-002101

    规格书

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    3-822516-6

    3-822516-6

    CONN SOCKET PLCC 84POS TIN

    TE Connectivity AMP Connectors

    4,556
    3-822516-6

    规格书

    - Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    HLS-0114-T-15

    HLS-0114-T-15

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,848
    HLS-0114-T-15

    规格书

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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