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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    13-0503-30

    13-0503-30

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,848
    13-0503-30

    规格书

    0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    08-2810-90T

    08-2810-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    3,561
    08-2810-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    3-1437538-2

    3-1437538-2

    CONN IC DIP SOCKET 40POS TINLEAD

    TE Connectivity AMP Connectors

    2,265
    3-1437538-2

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-83-101-15-101101

    510-83-101-15-101101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    3,642
    510-83-101-15-101101

    规格书

    510 Bulk Active PGA 101 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-43-314-41-801000

    123-43-314-41-801000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    2,414
    123-43-314-41-801000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-87-648-41-001101

    122-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    4,147
    122-87-648-41-001101

    规格书

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-176-15-061101

    510-87-176-15-061101

    CONN SOCKET PGA 176POS GOLD

    Preci-Dip

    4,493
    510-87-176-15-061101

    规格书

    510 Bulk Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0111-G-22

    HLS-0111-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,024
    HLS-0111-G-22

    规格书

    HLS Tube Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    14-6513-11H

    14-6513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,642
    14-6513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3518-111

    16-3518-111

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,139
    16-3518-111

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-3518-101H

    20-3518-101H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,769
    20-3518-101H

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-3518-101

    24-3518-101

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,428
    24-3518-101

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0511-10

    17-0511-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    1,834
    17-0511-10

    规格书

    511 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-0513-11H

    24-0513-11H

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    1,886
    24-0513-11H

    规格书

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0513-11H

    25-0513-11H

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,930
    25-0513-11H

    规格书

    0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0508-20

    16-0508-20

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    3,991
    16-0508-20

    规格书

    508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-1508-20

    16-1508-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,166
    16-1508-20

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-87-632-41-004101

    116-87-632-41-004101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,858
    116-87-632-41-004101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    824-AG11D

    824-AG11D

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    1,794
    824-AG11D

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    18-3513-11H

    18-3513-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,395
    18-3513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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