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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-83-640-41-007101

    116-83-640-41-007101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    1,759
    116-83-640-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-116-31-018000

    714-43-116-31-018000

    CONN SOCKET SIP 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,406
    714-43-116-31-018000

    规格书

    714 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-314-ZAGG

    ICO-314-ZAGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,754
    ICO-314-ZAGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-3518-10E

    20-3518-10E

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,551
    20-3518-10E

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0303-G-18

    HLS-0303-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,496
    HLS-0303-G-18

    规格书

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-0501-30

    12-0501-30

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    1,828
    12-0501-30

    规格书

    501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-6501-30

    18-6501-30

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    4,653
    18-6501-30

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6513-10H

    20-6513-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,780
    20-6513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-4820-90C

    10-4820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,940
    10-4820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6820-90C

    10-6820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    1,363
    10-6820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6822-90C

    10-6822-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,994
    10-6822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6823-90C

    10-6823-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    1,883
    10-6823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0116-G-2

    HLS-0116-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,431
    HLS-0116-G-2

    规格书

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    32-6518-10H

    32-6518-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,507
    32-6518-10H

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-316-ZLGG

    ICO-316-ZLGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,243
    ICO-316-ZLGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0402-G-12

    HLS-0402-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,693
    HLS-0402-G-12

    规格书

    HLS Bulk Active SIP 8 (4 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-324-ZSGT-L

    ICA-324-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,738
    ICA-324-ZSGT-L

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    12-6823-90T

    12-6823-90T

    CONN IC DIP SOCKET 12POS TIN

    Aries Electronics

    4,611
    12-6823-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    10-6823-90TWR

    10-6823-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    2,842
    10-6823-90TWR

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    18-0517-90C

    18-0517-90C

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,375
    18-0517-90C

    规格书

    0517 Bulk Active SIP 18 (1 x 18) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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