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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICA-314-WGG-2

    ICA-314-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,679
    ICA-314-WGG-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    40-3513-10

    40-3513-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,920
    40-3513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-114-13-001101

    510-83-114-13-001101

    CONN SOCKET PGA 114POS GOLD

    Preci-Dip

    3,566
    510-83-114-13-001101

    规格书

    510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-114-13-062101

    510-83-114-13-062101

    CONN SOCKET PGA 114POS GOLD

    Preci-Dip

    1,067
    510-83-114-13-062101

    规格书

    510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-652-41-035101

    146-83-652-41-035101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    1,637
    146-83-652-41-035101

    规格书

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-652-41-036101

    146-83-652-41-036101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,987
    146-83-652-41-036101

    规格书

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0310-T-2

    HLS-0310-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,022
    HLS-0310-T-2

    规格书

    HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    550-10-037-10-061101

    550-10-037-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    1,152
    550-10-037-10-061101

    规格书

    550 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-MGG

    ICO-316-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,693
    ICO-316-MGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2C-2002

    XR2C-2002

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    1,011
    XR2C-2002

    规格书

    XR2 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    50-9513-10

    50-9513-10

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,975
    50-9513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0517-90C

    21-0517-90C

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,842
    21-0517-90C

    规格书

    0517 Bulk Active SIP 21 (1 x 21) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6513-10H

    28-6513-10H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,288
    28-6513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-9513-10

    32-9513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,914
    32-9513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-4518-10H

    24-4518-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,707
    24-4518-10H

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-318-NGT

    ICO-318-NGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,793
    ICO-318-NGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    126-41-304-41-001000

    126-41-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,844
    126-41-304-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-304-41-001000

    126-91-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,842
    126-91-304-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    PGA145H003B1-1521R

    PGA145H003B1-1521R

    PGA SOCKET 145 CTS

    Amphenol ICC (FCI)

    1,680
    PGA145H003B1-1521R

    规格书

    - - Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    ICF-648-T-O

    ICF-648-T-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,874
    ICF-648-T-O

    规格书

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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