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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    104-11-304-41-770000

    104-11-304-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,953
    104-11-304-41-770000

    规格书

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-126-41-013000

    346-93-126-41-013000

    CONN SOCKET SIP 26POS GOLD

    Mill-Max Manufacturing Corp.

    3,273
    346-93-126-41-013000

    规格书

    346 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-126-41-013000

    346-43-126-41-013000

    CONN SOCKET SIP 26POS GOLD

    Mill-Max Manufacturing Corp.

    1,505
    346-43-126-41-013000

    规格书

    346 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-121-13-001101

    510-83-121-13-001101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    4,708
    510-83-121-13-001101

    规格书

    510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-121-13-041101

    510-83-121-13-041101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    2,023
    510-83-121-13-041101

    规格书

    510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6518-11

    48-6518-11

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,994
    48-6518-11

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-6501-30

    16-6501-30

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,900
    16-6501-30

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-624-T-M

    APA-624-T-M

    ADAPTER PLUG

    Samtec Inc.

    1,519
    APA-624-T-M

    规格书

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-422-T-M

    APA-422-T-M

    ADAPTER PLUG

    Samtec Inc.

    2,897
    APA-422-T-M

    规格书

    APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    08-2810-90

    08-2810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,928
    08-2810-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    24-516-10

    24-516-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,947
    24-516-10

    规格书

    516 Bulk Obsolete DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-316-AGT

    ICO-316-AGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,954
    ICO-316-AGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-648-ZSTT

    ICA-648-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,928
    ICA-648-ZSTT

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    APA-632-T-A1

    APA-632-T-A1

    ADAPTER PLUG

    Samtec Inc.

    2,778
    APA-632-T-A1

    规格书

    APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    PGA179H003B1-1836R

    PGA179H003B1-1836R

    PGA SOCKET 179 CTS

    Amphenol ICC (FCI)

    2,105
    PGA179H003B1-1836R

    规格书

    - - Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    ICO-320-MGG

    ICO-320-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,195
    ICO-320-MGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-13-001101

    510-83-132-13-001101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    2,658
    510-83-132-13-001101

    规格书

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-13-041101

    510-83-132-13-041101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    4,708
    510-83-132-13-041101

    规格书

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-14-001101

    510-83-132-14-001101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    2,565
    510-83-132-14-001101

    规格书

    510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3511-11

    18-3511-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,702
    18-3511-11

    规格书

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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