您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    10-7500-10

    10-7500-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    2,850
    10-7500-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7550-10

    10-7550-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    1,881
    10-7550-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7560-10

    10-7560-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    3,852
    10-7560-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7600-10

    10-7600-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,620
    10-7600-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7775-10

    10-7775-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    2,542
    10-7775-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7860-10

    10-7860-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    1,850
    10-7860-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7925-10

    10-7925-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,626
    10-7925-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-4810-90C

    10-4810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,582
    10-4810-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6810-90C

    10-6810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,030
    10-6810-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-632-ZSGT

    ICO-632-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,405
    ICO-632-ZSGT

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-432-41-013101

    116-83-432-41-013101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,934
    116-83-432-41-013101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0404-T-10

    HLS-0404-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,457
    HLS-0404-T-10

    规格书

    HLS Bulk Active SIP 16 (4 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    550-80-068-10-061101

    550-80-068-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    3,485
    550-80-068-10-061101

    规格书

    550 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    840-AG11D

    840-AG11D

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    3,054
    840-AG11D

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    20-3501-21

    20-3501-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,814
    20-3501-21

    规格书

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3501-31

    20-3501-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,910
    20-3501-31

    规格书

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-6501-20

    36-6501-20

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    4,107
    36-6501-20

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6501-30

    36-6501-30

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    4,808
    36-6501-30

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-1518-11H

    40-1518-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,719
    40-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0213-T-30

    HLS-0213-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,173
    HLS-0213-T-30

    规格书

    HLS Tube Active SIP 26 (2 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城