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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0320-T-T

    APH-0320-T-T

    APH-0320-T-T

    Samtec Inc.

    3,765
    APH-0320-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0820-T-T

    APH-0820-T-T

    APH-0820-T-T

    Samtec Inc.

    3,569
    APH-0820-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1220-T-T

    APH-1220-T-T

    APH-1220-T-T

    Samtec Inc.

    1,550
    APH-1220-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0420-T-T

    APH-0420-T-T

    APH-0420-T-T

    Samtec Inc.

    4,045
    APH-0420-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    110-99-304-61-001000

    110-99-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,574
    110-99-304-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-516-10

    40-516-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,737
    40-516-10

    规格书

    516 Bulk Obsolete DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-83-184-15-001101

    510-83-184-15-001101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    1,963
    510-83-184-15-001101

    规格书

    510 Bulk Active PGA 184 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-184-17-081101

    510-83-184-17-081101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    1,604
    510-83-184-17-081101

    规格书

    510 Bulk Active PGA 184 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0306-G-18

    HLS-0306-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,134
    HLS-0306-G-18

    规格书

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    APA-318-G-A1

    APA-318-G-A1

    ADAPTER PLUG

    Samtec Inc.

    3,855
    APA-318-G-A1

    规格书

    APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-318-G-A1

    APO-318-G-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,874
    APO-318-G-A1

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-G-R

    APO-308-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,806
    APO-308-G-R

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    15-0508-21

    15-0508-21

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,411
    15-0508-21

    规格书

    508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    15-0508-31

    15-0508-31

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,634
    15-0508-31

    规格书

    508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-C182-11H

    28-C182-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    1,939
    28-C182-11H

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-191-18-091101

    510-83-191-18-091101

    CONN SOCKET PGA 191POS GOLD

    Preci-Dip

    4,794
    510-83-191-18-091101

    规格书

    510 Bulk Active PGA 191 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-ZWGG

    ICA-320-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,152
    ICA-320-ZWGG

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-628-MGG

    ICO-628-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,381
    ICO-628-MGG

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    14-3503-21

    14-3503-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,447
    14-3503-21

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-3503-31

    14-3503-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    1,092
    14-3503-31

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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