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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICA-632-ZAGG

    ICA-632-ZAGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,550
    ICA-632-ZAGG

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-47-318-41-006000

    116-47-318-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    1,958
    116-47-318-41-006000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-306-41-001000

    612-11-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,144
    612-11-306-41-001000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6511-11

    32-6511-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,843
    32-6511-11

    规格书

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    317-91-115-41-005000

    317-91-115-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    1,786
    317-91-115-41-005000

    规格书

    317 Bulk Active SIP 15 (1 x 15) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0310-G-11

    HLS-0310-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,403
    HLS-0310-G-11

    规格书

    HLS Tube Active SIP 27 (3 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    317-93-109-41-005000

    317-93-109-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,655
    317-93-109-41-005000

    规格书

    317 Tube Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-324-T-B

    APO-324-T-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,067
    APO-324-T-B

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-41-314-41-003000

    116-41-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,369
    116-41-314-41-003000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-314-41-003000

    116-91-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,647
    116-91-314-41-003000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-320-41-006000

    116-47-320-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    1,128
    116-47-320-41-006000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-420-41-006000

    116-47-420-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,697
    116-47-420-41-006000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    88-PGM13041-10

    88-PGM13041-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,105
    88-PGM13041-10

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0426-T-T

    APH-0426-T-T

    APH-0426-T-T

    Samtec Inc.

    2,432
    APH-0426-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0926-T-T

    APH-0926-T-T

    APH-0926-T-T

    Samtec Inc.

    4,846
    APH-0926-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0626-T-T

    APH-0626-T-T

    APH-0626-T-T

    Samtec Inc.

    3,933
    APH-0626-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0826-T-T

    APH-0826-T-T

    APH-0826-T-T

    Samtec Inc.

    4,129
    APH-0826-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    115-44-422-41-003000

    115-44-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,848
    115-44-422-41-003000

    规格书

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    25-0503-20

    25-0503-20

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    1,851
    25-0503-20

    规格书

    0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    50-9518-10H

    50-9518-10H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,714
    50-9518-10H

    规格书

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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