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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-93-420-41-105000

    110-93-420-41-105000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    2,767
    110-93-420-41-105000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-420-41-105000

    110-43-420-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,776
    110-43-420-41-105000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-225-18-019101

    510-83-225-18-019101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    2,579
    510-83-225-18-019101

    规格书

    510 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-91-422-41-003000

    115-91-422-41-003000

    SOCKET IC OPEN LOWPRO .400 22POS

    Mill-Max Manufacturing Corp.

    1,567
    115-91-422-41-003000

    规格书

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-422-41-003000

    115-41-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,100
    115-41-422-41-003000

    规格书

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0114-G-3

    HLS-0114-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,797
    HLS-0114-G-3

    规格书

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    21-0501-21

    21-0501-21

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    2,687
    21-0501-21

    规格书

    501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    21-0501-31

    21-0501-31

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,043
    21-0501-31

    规格书

    501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    50-9513-10H

    50-9513-10H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,154
    50-9513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-93-318-41-105000

    110-93-318-41-105000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    4,641
    110-93-318-41-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1416-T-T

    APH-1416-T-T

    APH-1416-T-T

    Samtec Inc.

    3,744
    APH-1416-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0916-T-T

    APH-0916-T-T

    APH-0916-T-T

    Samtec Inc.

    3,796
    APH-0916-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0516-T-T

    APH-0516-T-T

    APH-0516-T-T

    Samtec Inc.

    2,751
    APH-0516-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1016-T-T

    APH-1016-T-T

    APH-1016-T-T

    Samtec Inc.

    1,367
    APH-1016-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1116-T-T

    APH-1116-T-T

    APH-1116-T-T

    Samtec Inc.

    1,584
    APH-1116-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0316-T-T

    APH-0316-T-T

    APH-0316-T-T

    Samtec Inc.

    2,818
    APH-0316-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1716-T-T

    APH-1716-T-T

    APH-1716-T-T

    Samtec Inc.

    4,339
    APH-1716-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    28-3503-20

    28-3503-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,241
    28-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    58-1518-00

    58-1518-00

    CONN IC DIP SOCKET 58POS GOLD

    Aries Electronics

    3,188
    58-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-81125-610C

    18-81125-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,219
    18-81125-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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