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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    111-91-428-41-001000

    111-91-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,518
    111-91-428-41-001000

    规格书

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-628-41-001000

    111-91-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,251
    111-91-628-41-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1437508-6

    3-1437508-6

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    3,701
    3-1437508-6

    规格书

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    28-3518-01

    28-3518-01

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,752
    28-3518-01

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-99-650-41-001000

    110-99-650-41-001000

    CONN IC DIP SOCKET 50POS TINLEAD

    Mill-Max Manufacturing Corp.

    3,656
    110-99-650-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-628-WGG

    ICA-628-WGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,026
    ICA-628-WGG

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    104-13-210-41-770000

    104-13-210-41-770000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    3,164
    104-13-210-41-770000

    规格书

    104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    121-13-310-41-001000

    121-13-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    1,741
    121-13-310-41-001000

    规格书

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-ZSGG

    ICA-640-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,212
    ICA-640-ZSGG

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-0508-21

    20-0508-21

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    4,840
    20-0508-21

    规格书

    508 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    20-0508-31

    20-0508-31

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    4,562
    20-0508-31

    规格书

    508 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    26-6823-90

    26-6823-90

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,290
    26-6823-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    30-6823-90T

    30-6823-90T

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    1,766
    30-6823-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    317-91-120-41-005000

    317-91-120-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    1,960
    317-91-120-41-005000

    规格书

    317 Bulk Active SIP 20 (1 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-316-41-013000

    146-41-316-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,504
    146-41-316-41-013000

    规格书

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-316-41-013000

    146-91-316-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,640
    146-91-316-41-013000

    规格书

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-113-41-005000

    317-43-113-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    1,689
    317-43-113-41-005000

    规格书

    317 Bulk Active SIP 13 (1 x 13) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-324-G-A

    APA-324-G-A

    ADAPTER PLUG

    Samtec Inc.

    3,527
    APA-324-G-A

    规格书

    APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0413-S-2

    HLS-0413-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,567
    HLS-0413-S-2

    规格书

    HLS Bulk Active SIP 52 (4 x 13) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APO-624-G-A

    APO-624-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,255
    APO-624-G-A

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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