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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    40-526-10

    40-526-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,671
    40-526-10

    规格书

    Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6554-10

    28-6554-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    1,337
    28-6554-10

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    25-0503-30

    25-0503-30

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    3,420
    25-0503-30

    规格书

    0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    110-91-632-41-001000

    110-91-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    1,420
    110-91-632-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    MPP-1100-05-DS-4GR(S1402)

    MPP-1100-05-DS-4GR(S1402)

    CONN TRANSIST TO-220/TO-247 5POS

    Sullins Connector Solutions

    4,104
    MPP-1100-05-DS-4GR(S1402)

    规格书

    - Tray Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Nickel Boron Through Hole, Right Angle - Solder - Gold 30.0µin (0.76µm) Nickel Boron Polyphenylene Sulfide (PPS) -65°C ~ 200°C
    24-6554-11

    24-6554-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,539
    24-6554-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6554-10

    48-6554-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    4,151
    48-6554-10

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6554-11

    40-6554-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,308
    40-6554-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    228-1277-00-0602J

    228-1277-00-0602J

    CONN IC DIP SOCKET ZIF 28POS GLD

    3M

    2,334
    228-1277-00-0602J

    规格书

    Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    0804MC

    0804MC

    CONN TRANSIST TO-3 8POS GOLD

    Texas Instruments

    1,202
    0804MC

    规格书

    - Tray Active Transistor, TO-3 8 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Polyester, Glass Filled -55°C ~ 150°C
    218-3341-00-0602J

    218-3341-00-0602J

    CONN IC DIP SOCKET ZIF 18POS GLD

    3M

    3,133
    218-3341-00-0602J

    规格书

    Textool™ Tray Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    216-7383-55-1902

    216-7383-55-1902

    CONN SOCKET SOIC 16POS GOLD

    3M

    1,681
    216-7383-55-1902

    规格书

    Textool™ Bulk Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    232-1287-00-0602J

    232-1287-00-0602J

    CONN IC DIP SOCKET ZIF 32POS GLD

    3M

    1,354
    232-1287-00-0602J

    规格书

    Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    210-2599-00-0602

    210-2599-00-0602

    CONN SOCKET SIP ZIF 10POS GOLD

    3M

    1,659
    210-2599-00-0602

    规格书

    Textool™ Bulk Active SIP, ZIF (ZIP) 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    224-5809-00-0602

    224-5809-00-0602

    CONN SOCKET SIP ZIF 24POS GOLD

    3M

    3,784
    224-5809-00-0602

    规格书

    Textool™ Bulk Active SIP, ZIF (ZIP) 24 (1 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    232-2601-00-0602

    232-2601-00-0602

    CONN SOCKET SIP ZIF 32POS GOLD

    3M

    1,645
    232-2601-00-0602

    规格书

    Textool™ Bulk Active SIP, ZIF (ZIP) 32 (1 x 32) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    108-PRS12005-12

    108-PRS12005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,312
    108-PRS12005-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    240-5205-00

    240-5205-00

    CONN SOCKET QFN 40POS GOLD

    3M

    2,932
    240-5205-00

    规格书

    Textool™ Bulk Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    248-5205-00

    248-5205-00

    CONN SOCKET QFN 48POS GOLD

    3M

    2,339
    248-5205-00

    规格书

    Textool™ Bulk Active QFN 48 (4 x 12) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    224-5205-01

    224-5205-01

    CONN SOCKET QFN 24POS GOLD

    3M

    3,948
    224-5205-01

    规格书

    Textool™ Bulk Active QFN 24 (4x4) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
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