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    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0722-T-T

    APH-0722-T-T

    APH-0722-T-T

    Samtec Inc.

    1,556
    APH-0722-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1622-T-T

    APH-1622-T-T

    APH-1622-T-T

    Samtec Inc.

    3,334
    APH-1622-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0322-T-T

    APH-0322-T-T

    APH-0322-T-T

    Samtec Inc.

    3,003
    APH-0322-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1722-T-T

    APH-1722-T-T

    APH-1722-T-T

    Samtec Inc.

    4,015
    APH-1722-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1222-T-T

    APH-1222-T-T

    APH-1222-T-T

    Samtec Inc.

    2,068
    APH-1222-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    124-41-310-41-002000

    124-41-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,292
    124-41-310-41-002000

    规格书

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-310-41-002000

    124-91-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,258
    124-91-310-41-002000

    规格书

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-310-41-001000

    122-13-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    3,415
    122-13-310-41-001000

    规格书

    122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-624-41-001000

    110-11-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    2,300
    110-11-624-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    110-11-324-41-001000

    110-11-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,255
    110-11-324-41-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-424-41-001000

    110-11-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,376
    110-11-424-41-001000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-1508-20

    40-1508-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,117
    40-1508-20

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    40-1508-30

    40-1508-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,455
    40-1508-30

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    605-93-314-11-480000

    605-93-314-11-480000

    SOCKET CARRIER LOWPRO .300 14POS

    Mill-Max Manufacturing Corp.

    1,925
    605-93-314-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-314-11-480000

    605-43-314-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,262
    605-43-314-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    22-0501-30

    22-0501-30

    CONN SOCKET SIP 22POS TIN

    Aries Electronics

    1,534
    22-0501-30

    规格书

    501 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    317-93-116-41-005000

    317-93-116-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,884
    317-93-116-41-005000

    规格书

    317 Tube Active SIP 16 (1 x 16) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-310-41-001000

    123-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,820
    123-11-310-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-632-41-105000

    110-41-632-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,449
    110-41-632-41-105000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-632-41-105000

    110-91-632-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,783
    110-91-632-41-105000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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