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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    126-93-316-41-001000

    126-93-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    2,675
    126-93-316-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-316-41-001000

    126-43-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,435
    126-43-316-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-T-R

    APO-640-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,151
    APO-640-T-R

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    612-43-210-41-004000

    612-43-210-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,448
    612-43-210-41-004000

    规格书

    612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-210-41-004000

    612-93-210-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,791
    612-93-210-41-004000

    规格书

    612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-3508-311

    14-3508-311

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,609
    14-3508-311

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6501-21

    28-6501-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,671
    28-6501-21

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6501-31

    28-6501-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,532
    28-6501-31

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    123-91-322-41-001000

    123-91-322-41-001000

    SOCKET IC OPEN 3 LVL .300 22POS

    Mill-Max Manufacturing Corp.

    1,646
    123-91-322-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-422-41-001000

    123-91-422-41-001000

    SOCKET IC OPEN 3 LVL .400 22POS

    Mill-Max Manufacturing Corp.

    4,635
    123-91-422-41-001000

    规格书

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-322-41-001000

    123-41-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,236
    123-41-322-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-422-41-001000

    123-41-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,276
    123-41-422-41-001000

    规格书

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    23-0503-21

    23-0503-21

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    3,673
    23-0503-21

    规格书

    0503 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    111-93-432-41-001000

    111-93-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,535
    111-93-432-41-001000

    规格书

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-432-41-001000

    111-43-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,659
    111-43-432-41-001000

    规格书

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-650-41-003000

    115-44-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,690
    115-44-650-41-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-210-41-001000

    612-11-210-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    1,475
    612-11-210-41-001000

    规格书

    612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-952-41-001000

    110-47-952-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,305
    110-47-952-41-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0407-G-10

    HLS-0407-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,099
    HLS-0407-G-10

    规格书

    HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    68-PGM11033-10H

    68-PGM11033-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,582
    68-PGM11033-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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