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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-93-324-31-002000

    614-93-324-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,152
    614-93-324-31-002000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-424-31-002000

    614-93-424-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,862
    614-93-424-31-002000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-624-31-002000

    614-93-624-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,855
    614-93-624-31-002000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-163-41-013000

    346-93-163-41-013000

    CONN SOCKET SIP 63POS GOLD

    Mill-Max Manufacturing Corp.

    3,689
    346-93-163-41-013000

    规格书

    346 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-163-41-013000

    346-43-163-41-013000

    CONN SOCKET SIP 63POS GOLD

    Mill-Max Manufacturing Corp.

    3,879
    346-43-163-41-013000

    规格书

    346 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0807-T-2

    HLS-0807-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,331
    HLS-0807-T-2

    规格书

    HLS Bulk Active SIP 56 (8 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-93-320-41-001000

    116-93-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    4,019
    116-93-320-41-001000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-41-001000

    116-93-420-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    1,100
    116-93-420-41-001000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-41-001000

    116-43-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,444
    116-43-320-41-001000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-420-41-001000

    116-43-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,920
    116-43-420-41-001000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-289-17-000101

    510-83-289-17-000101

    CONN SOCKET PGA 289POS GOLD

    Preci-Dip

    3,267
    510-83-289-17-000101

    规格书

    510 Bulk Active PGA 289 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-93-324-31-007000

    614-93-324-31-007000

    SOCKET CARRIER LOWPRO .300 24POS

    Mill-Max Manufacturing Corp.

    1,579
    614-93-324-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-424-31-007000

    614-93-424-31-007000

    SOCKET CARRIER LOWPRO .400 24POS

    Mill-Max Manufacturing Corp.

    1,093
    614-93-424-31-007000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-624-31-007000

    614-93-624-31-007000

    SOCKET CARRIER LOWPRO .600 24POS

    Mill-Max Manufacturing Corp.

    3,729
    614-93-624-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-324-31-007000

    614-43-324-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,366
    614-43-324-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-424-31-007000

    614-43-424-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,645
    614-43-424-31-007000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-624-31-007000

    614-43-624-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,125
    614-43-624-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-83-120-13-061117

    514-83-120-13-061117

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    2,692
    514-83-120-13-061117

    规格书

    514 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    19-0503-21

    19-0503-21

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,087
    19-0503-21

    规格书

    0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    19-0503-31

    19-0503-31

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    1,358
    19-0503-31

    规格书

    0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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