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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1610-G-R

    APH-1610-G-R

    APH-1610-G-R

    Samtec Inc.

    4,624
    APH-1610-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1410-G-R

    APH-1410-G-R

    APH-1410-G-R

    Samtec Inc.

    3,990
    APH-1410-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1710-G-R

    APH-1710-G-R

    APH-1710-G-R

    Samtec Inc.

    1,080
    APH-1710-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    28-6823-90

    28-6823-90

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,432
    28-6823-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    30-0501-30

    30-0501-30

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    1,918
    30-0501-30

    规格书

    501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6508-302

    32-6508-302

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,297
    32-6508-302

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-100-10-000112

    614-83-100-10-000112

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    1,731
    614-83-100-10-000112

    规格书

    614 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    26-6621-30

    26-6621-30

    CONN IC DIP SOCKET 26POS TIN

    Aries Electronics

    1,763
    26-6621-30

    规格书

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-328-41-001000

    126-41-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,625
    126-41-328-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-428-41-001000

    126-41-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,836
    126-41-428-41-001000

    规格书

    126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-628-41-001000

    126-41-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,304
    126-41-628-41-001000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-328-41-001000

    126-91-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,012
    126-91-328-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-428-41-001000

    126-91-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,151
    126-91-428-41-001000

    规格书

    126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-628-41-001000

    126-91-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,717
    126-91-628-41-001000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-652-41-105000

    110-41-652-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,135
    110-41-652-41-105000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-952-41-105000

    110-41-952-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,525
    110-41-952-41-105000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-652-41-105000

    110-91-652-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,220
    110-91-652-41-105000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-952-41-105000

    110-91-952-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,523
    110-91-952-41-105000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-084-13-081101

    550-10-084-13-081101

    PGA SOLDER TAIL

    Preci-Dip

    1,958
    550-10-084-13-081101

    规格书

    550 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-93-316-41-002000

    124-93-316-41-002000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    2,221
    124-93-316-41-002000

    规格书

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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