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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    22-0503-21

    22-0503-21

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    4,554
    22-0503-21

    规格书

    0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-0503-31

    22-0503-31

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    2,414
    22-0503-31

    规格书

    0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-3508-211

    16-3508-211

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,409
    16-3508-211

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-3508-311

    16-3508-311

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,805
    16-3508-311

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-47-652-41-006000

    116-47-652-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,795
    116-47-652-41-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0610-T-2

    HLS-0610-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,561
    HLS-0610-T-2

    规格书

    HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-1814-G-R

    APH-1814-G-R

    APH-1814-G-R

    Samtec Inc.

    1,420
    APH-1814-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0514-G-R

    APH-0514-G-R

    APH-0514-G-R

    Samtec Inc.

    2,417
    APH-0514-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1514-G-R

    APH-1514-G-R

    APH-1514-G-R

    Samtec Inc.

    2,826
    APH-1514-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1714-G-R

    APH-1714-G-R

    APH-1714-G-R

    Samtec Inc.

    1,879
    APH-1714-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0814-G-R

    APH-0814-G-R

    APH-0814-G-R

    Samtec Inc.

    3,916
    APH-0814-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1614-G-R

    APH-1614-G-R

    APH-1614-G-R

    Samtec Inc.

    4,945
    APH-1614-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0714-G-R

    APH-0714-G-R

    APH-0714-G-R

    Samtec Inc.

    3,979
    APH-0714-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    111-47-952-41-001000

    111-47-952-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,060
    111-47-952-41-001000

    规格书

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-318-41-003000

    126-93-318-41-003000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    3,365
    126-93-318-41-003000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-318-41-003000

    126-43-318-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,642
    126-43-318-41-003000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-3513-11H

    36-3513-11H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,117
    36-3513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-7440-10

    28-7440-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    3,660
    28-7440-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-7770-10

    28-7770-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    3,949
    28-7770-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-7850-10

    28-7850-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    3,767
    28-7850-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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