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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0226-T-R

    APH-0226-T-R

    APH-0226-T-R

    Samtec Inc.

    1,034
    APH-0226-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1326-T-R

    APH-1326-T-R

    APH-1326-T-R

    Samtec Inc.

    2,629
    APH-1326-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0828-T-T

    APH-0828-T-T

    APH-0828-T-T

    Samtec Inc.

    1,042
    APH-0828-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1628-T-T

    APH-1628-T-T

    APH-1628-T-T

    Samtec Inc.

    4,326
    APH-1628-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1126-T-R

    APH-1126-T-R

    APH-1126-T-R

    Samtec Inc.

    1,503
    APH-1126-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    123-13-422-41-801000

    123-13-422-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    1,539
    123-13-422-41-801000

    规格书

    123 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6553-11

    32-6553-11

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,185
    32-6553-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-41-320-61-001000

    110-41-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,310
    110-41-320-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-320-61-001000

    110-43-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,995
    110-43-320-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-320-61-001000

    110-91-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,047
    110-91-320-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-432-31-018000

    614-41-432-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,250
    614-41-432-31-018000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-632-31-018000

    614-41-632-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,111
    614-41-632-31-018000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-432-31-018000

    614-91-432-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,803
    614-91-432-31-018000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-632-31-018000

    614-91-632-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,684
    614-91-632-31-018000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-132-31-012000

    714-93-132-31-012000

    SOCKET CARRIER SIP 32POS

    Mill-Max Manufacturing Corp.

    4,013
    714-93-132-31-012000

    规格书

    714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    29-71250-10

    29-71250-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    1,010
    29-71250-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-7600-10

    29-7600-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    4,015
    29-7600-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-7625-10

    29-7625-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    4,043
    29-7625-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6810-90

    20-6810-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,170
    20-6810-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-41-650-41-006000

    116-41-650-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,720
    116-41-650-41-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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