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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    612-93-624-41-004000

    612-93-624-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,457
    612-93-624-41-004000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-642-41-006000

    116-93-642-41-006000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    1,203
    116-93-642-41-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-642-41-006000

    116-43-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,643
    116-43-642-41-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-640-61-001000

    110-43-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,609
    110-43-640-61-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-640-61-001000

    110-93-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,113
    110-93-640-61-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-952-41-001000

    110-93-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,742
    110-93-952-41-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-952-41-001000

    110-43-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,369
    110-43-952-41-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-41-952-41-001000

    115-41-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,621
    115-41-952-41-001000

    规格书

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-952-41-001000

    115-91-952-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    2,999
    115-91-952-41-001000

    规格书

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6556-11

    32-6556-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,131
    32-6556-11

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    612-11-324-41-001000

    612-11-324-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,657
    612-11-324-41-001000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-424-41-001000

    612-11-424-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,896
    612-11-424-41-001000

    规格书

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-624-41-001000

    612-11-624-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,508
    612-11-624-41-001000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6823-90C

    36-6823-90C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,853
    36-6823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-41-636-41-008000

    116-41-636-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,740
    116-41-636-41-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-636-41-008000

    116-91-636-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,144
    116-91-636-41-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    50-9518-11H

    50-9518-11H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,500
    50-9518-11H

    规格书

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    712-13-120-41-001000

    712-13-120-41-001000

    CONN SOCKET SIP 20POS GOLD

    Mill-Max Manufacturing Corp.

    2,069
    712-13-120-41-001000

    规格书

    712 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-93-210-41-002000

    124-93-210-41-002000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    3,845
    124-93-210-41-002000

    规格书

    124 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-210-41-002000

    124-43-210-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,017
    124-43-210-41-002000

    规格书

    124 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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