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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-43-650-41-105000

    110-43-650-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,444
    110-43-650-41-105000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-950-41-105000

    110-43-950-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,027
    110-43-950-41-105000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-328-41-801000

    110-43-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,803
    110-43-328-41-801000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-328-41-801000

    110-93-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,934
    110-93-328-41-801000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0512-G-T

    APH-0512-G-T

    APH-0512-G-T

    Samtec Inc.

    1,265
    APH-0512-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1912-G-T

    APH-1912-G-T

    APH-1912-G-T

    Samtec Inc.

    3,520
    APH-1912-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0212-G-T

    APH-0212-G-T

    APH-0212-G-T

    Samtec Inc.

    4,808
    APH-0212-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1612-G-T

    APH-1612-G-T

    APH-1612-G-T

    Samtec Inc.

    4,479
    APH-1612-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0912-G-T

    APH-0912-G-T

    APH-0912-G-T

    Samtec Inc.

    2,971
    APH-0912-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0412-G-T

    APH-0412-G-T

    APH-0412-G-T

    Samtec Inc.

    4,419
    APH-0412-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    116-41-650-41-003000

    116-41-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,181
    116-41-650-41-003000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-003000

    116-91-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,651
    116-91-650-41-003000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-652-41-001000

    110-11-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,713
    110-11-652-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0318-T-31

    HLS-0318-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,611
    HLS-0318-T-31

    规格书

    HLS Tube Active SIP 54 (3 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    104-11-636-41-770000

    104-11-636-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,919
    104-11-636-41-770000

    规格书

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-318-41-001000

    123-13-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    1,760
    123-13-318-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3575-10

    32-3575-10

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    4,045
    32-3575-10

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    123-11-322-41-001000

    123-11-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,943
    123-11-322-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-422-41-001000

    123-11-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,584
    123-11-422-41-001000

    规格书

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-0508-21

    27-0508-21

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    4,088
    27-0508-21

    规格书

    508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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