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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APO-316-G-B

    APO-316-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,722
    APO-316-G-B

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0614-G-T

    APH-0614-G-T

    APH-0614-G-T

    Samtec Inc.

    4,302
    APH-0614-G-T

    规格书

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    APH-0414-G-T

    APH-0414-G-T

    APH-0414-G-T

    Samtec Inc.

    2,347
    APH-0414-G-T

    规格书

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    APH-1614-G-T

    APH-1614-G-T

    APH-1614-G-T

    Samtec Inc.

    1,830
    APH-1614-G-T

    规格书

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    614-93-642-31-018000

    614-93-642-31-018000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    1,109
    614-93-642-31-018000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-642-31-018000

    614-43-642-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,055
    614-43-642-31-018000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-628-ZHGG

    ICA-628-ZHGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,949
    ICA-628-ZHGG

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    546-83-145-15-081135

    546-83-145-15-081135

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    4,580
    546-83-145-15-081135

    规格书

    546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-145-15-081136

    546-83-145-15-081136

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    1,054
    546-83-145-15-081136

    规格书

    546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    34-6621-30

    34-6621-30

    CONN IC DIP SOCKET 34POS TIN

    Aries Electronics

    2,532
    34-6621-30

    规格书

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    69-PGM11030-11

    69-PGM11030-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,496
    69-PGM11030-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    69-PGM11031-11

    69-PGM11031-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,885
    69-PGM11031-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    69-PGM11053-11

    69-PGM11053-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,940
    69-PGM11053-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    132-PGM14016-10

    132-PGM14016-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,042
    132-PGM14016-10

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-640-41-003000

    612-41-640-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,391
    612-41-640-41-003000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-640-41-003000

    612-91-640-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,830
    612-91-640-41-003000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-640-41-770000

    104-13-640-41-770000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    1,979
    104-13-640-41-770000

    规格书

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    116-41-650-41-008000

    116-41-650-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,402
    116-41-650-41-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-008000

    116-91-650-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,077
    116-91-650-41-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1818-G-T

    APH-1818-G-T

    APH-1818-G-T

    Samtec Inc.

    1,179
    APH-1818-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
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