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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    546-83-149-15-063136

    546-83-149-15-063136

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    1,340
    546-83-149-15-063136

    规格书

    546 Bulk Active PGA 149 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-320-G-Q

    APA-320-G-Q

    ADAPTER PLUG

    Samtec Inc.

    4,304
    APA-320-G-Q

    规格书

    APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    614-41-650-31-007000

    614-41-650-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,501
    614-41-650-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-650-31-007000

    614-91-650-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,592
    614-91-650-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8058-1G19

    8058-1G19

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    4,460
    8058-1G19

    规格书

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    126-93-642-41-001000

    126-93-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    3,522
    126-93-642-41-001000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-642-41-001000

    126-43-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,232
    126-43-642-41-001000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-420-61-001000

    110-91-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,593
    110-91-420-61-001000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-632-G-N

    APA-632-G-N

    ADAPTER PLUG

    Samtec Inc.

    4,272
    APA-632-G-N

    规格书

    APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    110-93-308-61-605000

    110-93-308-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,581
    110-93-308-61-605000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    50-9503-20

    50-9503-20

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,087
    50-9503-20

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    50-9503-30

    50-9503-30

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,694
    50-9503-30

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-650-41-001000

    126-41-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,208
    126-41-650-41-001000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-650-41-001000

    126-91-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,961
    126-91-650-41-001000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-642-41-001000

    123-93-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    4,182
    123-93-642-41-001000

    规格书

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-642-41-001000

    123-43-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,026
    123-43-642-41-001000

    规格书

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-640-41-001000

    614-93-640-41-001000

    SOCKET CARRIER LOWPRO .600 40POS

    Mill-Max Manufacturing Corp.

    1,586
    614-93-640-41-001000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-640-41-001000

    614-43-640-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,853
    614-43-640-41-001000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-41-006000

    116-93-950-41-006000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    3,507
    116-93-950-41-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-950-41-006000

    116-43-950-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,974
    116-43-950-41-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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