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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    32-3553-11

    32-3553-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    3,256
    32-3553-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6551-11

    32-6551-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    1,484
    32-6551-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-11

    32-6552-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    4,653
    32-6552-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3554-11

    32-3554-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    1,814
    32-3554-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    614-93-648-31-007000

    614-93-648-31-007000

    SOCKET CARRIER LOWPRO .600 48POS

    Mill-Max Manufacturing Corp.

    2,110
    614-93-648-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-648-31-007000

    614-43-648-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,109
    614-43-648-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-640-CGG

    ICO-640-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,217
    ICO-640-CGG

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    104-13-642-41-780000

    104-13-642-41-780000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    4,757
    104-13-642-41-780000

    规格书

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    APH-0534-T-R

    APH-0534-T-R

    APH-0534-T-R

    Samtec Inc.

    3,136
    APH-0534-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1434-T-R

    APH-1434-T-R

    APH-1434-T-R

    Samtec Inc.

    4,410
    APH-1434-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1034-T-R

    APH-1034-T-R

    APH-1034-T-R

    Samtec Inc.

    3,641
    APH-1034-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1534-T-R

    APH-1534-T-R

    APH-1534-T-R

    Samtec Inc.

    3,978
    APH-1534-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1134-T-R

    APH-1134-T-R

    APH-1134-T-R

    Samtec Inc.

    3,965
    APH-1134-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    126-41-636-41-003000

    126-41-636-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,891
    126-41-636-41-003000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-636-41-003000

    126-91-636-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,563
    126-91-636-41-003000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    326-93-132-41-002000

    326-93-132-41-002000

    SOCKET WRAP SOLDERTAIL SIP 32POS

    Mill-Max Manufacturing Corp.

    2,140
    326-93-132-41-002000

    规格书

    326 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-640-41-001000

    116-93-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    1,013
    116-93-640-41-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-640-41-001000

    116-43-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,646
    116-43-640-41-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-952-31-002000

    614-41-952-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,191
    614-41-952-31-002000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-952-31-002000

    614-91-952-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,017
    614-91-952-31-002000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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