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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    550-10-192M16-001166

    550-10-192M16-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,130
    550-10-192M16-001166

    规格书

    550 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    614-41-952-41-001000

    614-41-952-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,736
    614-41-952-41-001000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-952-41-001000

    614-91-952-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,289
    614-91-952-41-001000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-81250-610C

    36-81250-610C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,239
    36-81250-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-8580-610C

    36-8580-610C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    1,327
    36-8580-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-8750-310C

    36-8750-310C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,919
    36-8750-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    104-11-652-41-780000

    104-11-652-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,613
    104-11-652-41-780000

    规格书

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    416-93-264-41-006000

    416-93-264-41-006000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    2,311
    416-93-264-41-006000

    规格书

    416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - - -
    614-93-950-31-012000

    614-93-950-31-012000

    SOCKET CARRIER LOWPRO .900 50POS

    Mill-Max Manufacturing Corp.

    3,714
    614-93-950-31-012000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-950-31-012000

    614-43-950-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,639
    614-43-950-31-012000

    规格书

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-324-61-003000

    115-43-324-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,055
    115-43-324-61-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-624-61-003000

    115-43-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,357
    115-43-624-61-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-324-61-003000

    115-93-324-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,619
    115-93-324-61-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-624-61-003000

    115-93-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,026
    115-93-624-61-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-13-636-41-001000

    121-13-636-41-001000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    4,274
    121-13-636-41-001000

    规格书

    121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-3574-10

    40-3574-10

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    2,294
    40-3574-10

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-41-650-41-001000

    116-41-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,646
    116-41-650-41-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-001000

    116-91-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,349
    116-91-650-41-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-310-61-001000

    110-43-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,808
    110-43-310-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-310-61-001000

    110-93-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,992
    110-93-310-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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