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    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1638-T-H

    APH-1638-T-H

    APH-1638-T-H

    Samtec Inc.

    2,120
    APH-1638-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0438-T-H

    APH-0438-T-H

    APH-0438-T-H

    Samtec Inc.

    1,984
    APH-0438-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0638-T-H

    APH-0638-T-H

    APH-0638-T-H

    Samtec Inc.

    2,562
    APH-0638-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0838-T-H

    APH-0838-T-H

    APH-0838-T-H

    Samtec Inc.

    1,855
    APH-0838-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1738-T-H

    APH-1738-T-H

    APH-1738-T-H

    Samtec Inc.

    4,591
    APH-1738-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    116-43-320-61-003000

    116-43-320-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,388
    116-43-320-61-003000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-324-G-B

    APA-324-G-B

    ADAPTER PLUG

    Samtec Inc.

    3,171
    APA-324-G-B

    规格书

    APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-624-G-B

    APO-624-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,691
    APO-624-G-B

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    517-83-299-16-091111

    517-83-299-16-091111

    CONN SOCKET PGA 299POS GOLD

    Preci-Dip

    1,943
    517-83-299-16-091111

    规格书

    517 Bulk Active PGA 299 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-41-648-41-004000

    612-41-648-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,641
    612-41-648-41-004000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-648-41-004000

    612-91-648-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,379
    612-91-648-41-004000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-964-41-007000

    116-41-964-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,970
    116-41-964-41-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-964-41-007000

    116-91-964-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,715
    116-91-964-41-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-640-AGG

    ICO-640-AGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,665
    ICO-640-AGG

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-640-AGG

    ICA-640-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,181
    ICA-640-AGG

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    714-93-264-31-012000

    714-93-264-31-012000

    SOCKET CARRIER DUAL INLINE 64POS

    Mill-Max Manufacturing Corp.

    2,911
    714-93-264-31-012000

    规格书

    714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-81000-610C

    38-81000-610C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,012
    38-81000-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-81250-610C

    38-81250-610C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,328
    38-81250-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-952-41-003000

    612-41-952-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,604
    612-41-952-41-003000

    规格书

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-952-41-003000

    612-91-952-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,038
    612-91-952-41-003000

    规格书

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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