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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    36-3503-21

    36-3503-21

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,746
    36-3503-21

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-3503-31

    36-3503-31

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,083
    36-3503-31

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    546-83-192-14-001135

    546-83-192-14-001135

    CONN SOCKET PGA 192POS GOLD

    Preci-Dip

    3,177
    546-83-192-14-001135

    规格书

    546 Bulk Active PGA 192 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-192-14-001136

    546-83-192-14-001136

    CONN SOCKET PGA 192POS GOLD

    Preci-Dip

    4,636
    546-83-192-14-001136

    规格书

    546 Bulk Active PGA 192 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    126-93-652-41-003000

    126-93-652-41-003000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,651
    126-93-652-41-003000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-652-41-003000

    126-43-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,349
    126-43-652-41-003000

    规格书

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-328-61-105000

    110-93-328-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,790
    110-93-328-61-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-428-61-105000

    110-93-428-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,905
    110-93-428-61-105000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-964-41-001000

    123-91-964-41-001000

    SOCKET IC OPEN 3 LVL .900 64POS

    Mill-Max Manufacturing Corp.

    2,156
    123-91-964-41-001000

    规格书

    123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-964-41-001000

    123-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,064
    123-41-964-41-001000

    规格书

    123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-650-41-001000

    122-13-650-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,853
    122-13-650-41-001000

    规格书

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0407-G-18

    HLS-0407-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,072
    HLS-0407-G-18

    规格书

    HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    115-43-636-61-003000

    115-43-636-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,803
    115-43-636-61-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-952-41-001000

    123-93-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    2,801
    123-93-952-41-001000

    规格书

    123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-952-41-001000

    123-43-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,595
    123-43-952-41-001000

    规格书

    123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-91-168-17-101002

    510-91-168-17-101002

    SOCKET SOLDERTAIL 168-PGA

    Mill-Max Manufacturing Corp.

    4,573
    510-91-168-17-101002

    规格书

    510 Tube Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-124-13-041001

    510-93-124-13-041001

    CONN SOCKET PGA 124POS GOLD

    Mill-Max Manufacturing Corp.

    3,080
    510-93-124-13-041001

    规格书

    510 Tube Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-41-168-17-101002

    510-41-168-17-101002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,680
    510-41-168-17-101002

    规格书

    510 Tube Active PGA 168 (17 x 17) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-640-61-003000

    116-43-640-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,161
    116-43-640-61-003000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-640-61-003000

    116-93-640-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,767
    116-93-640-61-003000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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