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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1420-G-T

    APH-1420-G-T

    APH-1420-G-T

    Samtec Inc.

    3,062
    APH-1420-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0620-G-T

    APH-0620-G-T

    APH-0620-G-T

    Samtec Inc.

    1,623
    APH-0620-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1720-G-T

    APH-1720-G-T

    APH-1720-G-T

    Samtec Inc.

    1,930
    APH-1720-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0320-G-T

    APH-0320-G-T

    APH-0320-G-T

    Samtec Inc.

    3,779
    APH-0320-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    121-13-950-41-001000

    121-13-950-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    4,108
    121-13-950-41-001000

    规格书

    121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-964-41-001000

    116-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,202
    116-41-964-41-001000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-964-41-001000

    116-91-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,685
    116-91-964-41-001000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-650-61-006000

    116-43-650-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,820
    116-43-650-61-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-636-61-008000

    116-43-636-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,045
    116-43-636-61-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-636-61-008000

    116-93-636-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,766
    116-93-636-61-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    416-93-264-41-008000

    416-93-264-41-008000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    2,696
    416-93-264-41-008000

    规格书

    416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - - -
    116-43-420-61-001000

    116-43-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,183
    116-43-420-61-001000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-320-61-001000

    116-93-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,827
    116-93-320-61-001000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-61-001000

    116-93-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,588
    116-93-420-61-001000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-636-61-001000

    111-43-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,460
    111-43-636-61-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-636-61-001000

    111-93-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,534
    111-93-636-61-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-91-064-10-051003

    510-91-064-10-051003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,291
    510-91-064-10-051003

    规格书

    510 Bulk Active PGA 64 (10 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-428-61-005000

    117-93-428-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,853
    117-93-428-61-005000

    规格书

    117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-41-964-41-002000

    124-41-964-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,393
    124-41-964-41-002000

    规格书

    124 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-964-41-002000

    124-91-964-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,408
    124-91-964-41-002000

    规格书

    124 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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