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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0632-G-T

    APH-0632-G-T

    APH-0632-G-T

    Samtec Inc.

    2,374
    APH-0632-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1332-G-T

    APH-1332-G-T

    APH-1332-G-T

    Samtec Inc.

    4,129
    APH-1332-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0732-G-T

    APH-0732-G-T

    APH-0732-G-T

    Samtec Inc.

    4,526
    APH-0732-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1132-G-T

    APH-1132-G-T

    APH-1132-G-T

    Samtec Inc.

    1,245
    APH-1132-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    116-43-950-61-001000

    116-43-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,645
    116-43-950-61-001000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-61-001000

    116-93-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,490
    116-93-950-61-001000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6554-16

    32-6554-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,515
    32-6554-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0430-G-R

    APH-0430-G-R

    APH-0430-G-R

    Samtec Inc.

    4,109
    APH-0430-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1830-G-R

    APH-1830-G-R

    APH-1830-G-R

    Samtec Inc.

    4,997
    APH-1830-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1530-G-R

    APH-1530-G-R

    APH-1530-G-R

    Samtec Inc.

    3,658
    APH-1530-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1930-G-R

    APH-1930-G-R

    APH-1930-G-R

    Samtec Inc.

    2,300
    APH-1930-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0630-G-R

    APH-0630-G-R

    APH-0630-G-R

    Samtec Inc.

    3,528
    APH-0630-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1230-G-R

    APH-1230-G-R

    APH-1230-G-R

    Samtec Inc.

    1,739
    APH-1230-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1330-G-R

    APH-1330-G-R

    APH-1330-G-R

    Samtec Inc.

    1,113
    APH-1330-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    550-10-356M26-001166

    550-10-356M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,346
    550-10-356M26-001166

    规格书

    550 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    116-43-952-61-001000

    116-43-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,394
    116-43-952-61-001000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-952-61-001000

    116-93-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,930
    116-93-952-61-001000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-528-21-121111

    517-83-528-21-121111

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    4,468
    517-83-528-21-121111

    规格书

    517 Bulk Active PGA 528 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    44-3571-11

    44-3571-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    4,552
    44-3571-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3575-11

    44-3575-11

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,357
    44-3575-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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