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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    24-3570-16

    24-3570-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,031
    24-3570-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    24-3571-16

    24-3571-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,489
    24-3571-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    APH-1434-G-H

    APH-1434-G-H

    APH-1434-G-H

    Samtec Inc.

    4,353
    APH-1434-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0534-G-H

    APH-0534-G-H

    APH-0534-G-H

    Samtec Inc.

    2,297
    APH-0534-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0934-G-H

    APH-0934-G-H

    APH-0934-G-H

    Samtec Inc.

    1,428
    APH-0934-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1934-G-H

    APH-1934-G-H

    APH-1934-G-H

    Samtec Inc.

    3,250
    APH-1934-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1134-G-H

    APH-1134-G-H

    APH-1134-G-H

    Samtec Inc.

    2,966
    APH-1134-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0634-G-H

    APH-0634-G-H

    APH-0634-G-H

    Samtec Inc.

    4,082
    APH-0634-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1634-G-H

    APH-1634-G-H

    APH-1634-G-H

    Samtec Inc.

    2,511
    APH-1634-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0334-G-H

    APH-0334-G-H

    APH-0334-G-H

    Samtec Inc.

    3,309
    APH-0334-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1734-G-H

    APH-1734-G-H

    APH-1734-G-H

    Samtec Inc.

    4,015
    APH-1734-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1334-G-H

    APH-1334-G-H

    APH-1334-G-H

    Samtec Inc.

    1,148
    APH-1334-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    546-83-325-18-111147

    546-83-325-18-111147

    CONN SOCKET PGA 325POS GOLD

    Preci-Dip

    4,693
    546-83-325-18-111147

    规格书

    546 Bulk Active PGA 325 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-255M16-001101

    558-10-255M16-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    3,025
    558-10-255M16-001101

    规格书

    558 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-388M26-001166

    550-10-388M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,044
    550-10-388M26-001166

    规格书

    550 Bulk Active BGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    32-6556-40

    32-6556-40

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,146
    32-6556-40

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-256M20-001101

    558-10-256M20-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    1,599
    558-10-256M20-001101

    规格书

    558 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-256M16-000101

    558-10-256M16-000101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,558
    558-10-256M16-000101

    规格书

    558 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-272M20-001152

    550-10-272M20-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,994
    550-10-272M20-001152

    规格书

    550 Bulk Active BGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-0936-G-T

    APH-0936-G-T

    APH-0936-G-T

    Samtec Inc.

    2,298
    APH-0936-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
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