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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    100-032-051

    100-032-051

    CONN IC DIP SOCKET 32POS GOLD

    3M

    2,029
    100-032-051

    规格书

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-040-050

    100-040-050

    CONN IC DIP SOCKET 40POS GOLD

    3M

    1,728
    100-040-050

    规格书

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-040-051

    100-040-051

    CONN IC DIP SOCKET 40POS GOLD

    3M

    1,553
    100-040-051

    规格书

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-042-050

    100-042-050

    CONN IC DIP SOCKET 42POS GOLD

    3M

    1,583
    100-042-050

    规格书

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-048-050

    100-048-050

    CONN IC DIP SOCKET 48POS GOLD

    3M

    2,256
    100-048-050

    规格书

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    822516-1

    822516-1

    CONN SOCKET PLCC 44POS TIN

    TE Connectivity AMP Connectors

    1,532
    822516-1

    规格书

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    822516-6

    822516-6

    CONN SOCKET PLCC 84POS TIN

    TE Connectivity AMP Connectors

    3,891
    822516-6

    规格书

    - Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    XR2A-2815

    XR2A-2815

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    1,860
    XR2A-2815

    规格书

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-1511-N

    XR2C-1511-N

    CONN SOCKET SIP 15POS GOLD

    Omron Electronics Inc-EMC Div

    4,628
    XR2C-1511-N

    规格书

    XR2 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2E-3204

    XR2E-3204

    CONN SOCKET SIP 32POS GOLD

    Omron Electronics Inc-EMC Div

    4,559
    XR2E-3204

    规格书

    XR2 Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2H-1611-N

    XR2H-1611-N

    CONN ZIG-ZAG 16POS GOLD

    Omron Electronics Inc-EMC Div

    3,914
    XR2H-1611-N

    规格书

    XR2 Bulk Active Zig-Zag 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    2-1814640-0

    2-1814640-0

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    4,892
    2-1814640-0

    规格书

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    1814654-3

    1814654-3

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,718
    1814654-3

    规格书

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) - - Bronze Thermoplastic, Polyester -55°C ~ 125°C
    1-822473-3

    1-822473-3

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    2,917
    1-822473-3

    规格书

    - Box Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Thermoplastic -
    1-390262-5

    1-390262-5

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    2,429
    1-390262-5

    规格书

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390262-7

    1-390262-7

    CONN IC DIP SOCKET 48POS TIN

    TE Connectivity AMP Connectors

    2,397
    1-390262-7

    规格书

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390263-2

    1-390263-2

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    3,697
    1-390263-2

    规格书

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    210227-4

    210227-4

    CONN SOCKET PGA 169POS GOLD

    TE Connectivity AMP Connectors

    2,293
    210227-4

    规格书

    - Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 196.9µin (5.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
    2-5916783-5

    2-5916783-5

    CONN SOCKET PGA ZIF 370POS GOLD

    TE Connectivity AMP Connectors

    3,374
    2-5916783-5

    规格书

    - Tray Active PGA, ZIF (ZIP) 370 (19 x 19) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Copper Alloy Liquid Crystal Polymer (LCP) -
    69802-128LF

    69802-128LF

    CONN SOCKET PLCC 28POS TIN

    Amphenol ICC (FCI)

    4,993
    69802-128LF

    规格书

    - Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
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