您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    0050395288

    0050395288

    CONN IC DIP SOCKET 28POS TINLEAD

    Molex

    3,667
    0050395288

    规格书

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - - -
    940-99-032-24-000000

    940-99-032-24-000000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    1,676
    940-99-032-24-000000

    规格书

    940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    SIP1X11-011B

    SIP1X11-011B

    SIP1X11-011B-SIP SOCKET 11 CTS

    Amphenol ICC (FCI)

    4,379
    SIP1X11-011B

    规格书

    SIP1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    AR 22-HGL-TT

    AR 22-HGL-TT

    SOCKET

    Assmann WSW Components

    3,866
    AR 22-HGL-TT

    规格书

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR22-HZL-TT

    AR22-HZL-TT

    CONN IC DIP SOCKET 22POS TIN

    Assmann WSW Components

    1,194
    AR22-HZL-TT

    规格书

    - Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-83-306-41-003101

    115-83-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    1,374
    115-83-306-41-003101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-001101

    116-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,289
    116-87-304-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS44-Z-SM

    A-CCS44-Z-SM

    CONN SOCKET PLCC 44POS TIN

    Assmann WSW Components

    2,321
    A-CCS44-Z-SM

    规格书

    - Bag Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    HLS-0201-T-2

    HLS-0201-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,741
    HLS-0201-T-2

    规格书

    HLS Tube Active SIP 2 (2 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    940-99-044-24-000000

    940-99-044-24-000000

    CONN SOCKET PLCC 44POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,743
    940-99-044-24-000000

    规格书

    940 Tube Obsolete PLCC 44 (4 x 11) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-99-020-17-400000

    940-99-020-17-400000

    CONN SOCKET PLCC 20POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    1,491
    940-99-020-17-400000

    规格书

    940 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AJ 24-LC

    AJ 24-LC

    SOCKET

    Assmann WSW Components

    2,229
    AJ 24-LC

    规格书

    - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    123-83-304-41-001101

    123-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    1,670
    123-83-304-41-001101

    规格书

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP318-011B

    DIP318-011B

    DIP318-011B-DIP SOCKET 18 CTS

    Amphenol ICC (FCI)

    4,665
    DIP318-011B

    规格书

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    04-1518-10T

    04-1518-10T

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    1,316
    04-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP1X09-001B

    SIP1X09-001B

    SIP1X09-001B-SIP SOCKET 9 CTS

    Amphenol ICC (FCI)

    3,583
    SIP1X09-001B

    规格书

    SIP1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X07-157B

    SIP050-1X07-157B

    1X07-157B-SIP SOCKET 7 CTS

    Amphenol ICC (FCI)

    4,971
    SIP050-1X07-157B

    规格书

    SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X13-011B

    SIP1X13-011B

    SIP1X13-011B-SIP SOCKET 13 CTS

    Amphenol ICC (FCI)

    1,103
    SIP1X13-011B

    规格书

    SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X06-160B

    SIP050-1X06-160B

    1X06-160B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    1,603
    SIP050-1X06-160B

    规格书

    SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR20-HZL-TT

    AR20-HZL-TT

    CONN IC DIP SOCKET 20POS TIN

    Assmann WSW Components

    3,709
    AR20-HZL-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城