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| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D01-9971142CONN SOCKET SIP 11POS GOLD |
2,730 |
|
规格书 |
D01-997 | Tube | Active | SIP | 11 (1 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
D01-9971742CONN SOCKET SIP 17POS GOLD |
3,213 |
|
规格书 |
D01-997 | Tube | Active | SIP | 17 (1 x 17) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
D01-9971942CONN SOCKET SIP 19POS GOLD |
2,877 |
|
规格书 |
D01-997 | Tube | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
D01-9972242CONN SOCKET SIP 22POS GOLD |
3,746 |
|
规格书 |
D01-997 | Tube | Active | SIP | 22 (1 x 22) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
D0806-42CONN IC DIP SOCKET 6POS GOLD |
1,101 |
|
规格书 |
D0 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D0814-42CONN IC DIP SOCKET 14POS GOLD |
1,266 |
|
规格书 |
D0 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D0818-42CONN IC DIP SOCKET 18POS GOLD |
2,028 |
|
规格书 |
D0 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D0820-42CONN IC DIP SOCKET 20POS GOLD |
1,343 |
|
规格书 |
D0 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
D2806-42CONN IC DIP SOCKET 6POS GOLD |
3,633 |
|
规格书 |
D2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic | -55°C ~ 125°C |
|
D3906-42CONN IC DIP SOCKET 6POS GOLD |
1,133 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D3908-42CONN IC DIP SOCKET 8POS GOLD |
1,770 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D3914-42CONN IC DIP SOCKET 14POS GOLD |
4,450 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D3916-42CONN IC DIP SOCKET 16POS GOLD |
3,942 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D3918-42CONN IC DIP SOCKET 18POS GOLD |
1,359 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D3920-42CONN IC DIP SOCKET 20POS GOLD |
1,969 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D3924-42CONN IC DIP SOCKET 24POS GOLD |
4,769 |
|
规格书 |
D39 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D73064-42CONN IC DIP SOCKET 64POS GOLD |
4,937 |
|
规格书 |
D73064 | Tube | Obsolete | DIP, Staggered | 64 (2 x 32) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D83028C-46CONN SOCKET PLCC 28POS TIN |
1,382 |
|
规格书 |
D830 | Tube | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -50°C ~ 105°C |
|
|
D83044C-46CONN SOCKET PLCC 44POS TIN |
3,097 |
|
规格书 |
D830 | Tube | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -50°C ~ 105°C |
|
|
D83068C-46CONN SOCKET PLCC 68POS TIN |
2,338 |
|
规格书 |
D830 | Tube | Obsolete | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -50°C ~ 105°C |
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