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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-13-144-12-000012

    614-13-144-12-000012

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,212
    614-13-144-12-000012

    规格书

    614 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-13-223-18-098012

    614-13-223-18-098012

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,490
    614-13-223-18-098012

    规格书

    614 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-13-225-18-091007

    614-13-225-18-091007

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,816
    614-13-225-18-091007

    规格书

    614 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-13-400-20-000001

    614-13-400-20-000001

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,609
    614-13-400-20-000001

    规格书

    614 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-241-18-075012

    614-93-241-18-075012

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,600
    614-93-241-18-075012

    规格书

    614 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-44-084-17-400004

    940-44-084-17-400004

    CONN SKT PLCC

    Mill-Max Manufacturing Corp.

    4,171
    940-44-084-17-400004

    规格书

    940 Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    D01-9933201

    D01-9933201

    CONNECTOR

    Harwin Inc.

    2,058
    D01-9933201

    规格书

    D01-993 Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100" (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    8114LB603G

    8114LB603G

    HEATSINK

    Boyd Laconia, LLC

    4,776
    8114LB603G

    规格书

    - - Active - - - - - - - - - - - - - - -
    PX-20LCC

    PX-20LCC

    LEADLESS CHIP CARRIER 20P PBT RO

    Kycon, Inc.

    4,708
    PX-20LCC

    规格书

    PX Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-28LCC

    PX-28LCC

    LEADLESS CHIP CARRIER 28P PBT RO

    Kycon, Inc.

    4,212
    PX-28LCC

    规格书

    PX Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-32LCC

    PX-32LCC

    LEADLESS CHIP CARRIER 32P PBT RO

    Kycon, Inc.

    1,937
    PX-32LCC

    规格书

    PX Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-44LCC

    PX-44LCC

    LEADLESS CHIP CARRIER 44P PBT RO

    Kycon, Inc.

    4,047
    PX-44LCC

    规格书

    PX Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-52LCC

    PX-52LCC

    LEADLESS CHIP CARRIER 52P PBT RO

    Kycon, Inc.

    1,427
    PX-52LCC

    规格书

    PX Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-68LCC

    PX-68LCC

    LEADLESS CHIP CARRIER 68P PBT RO

    Kycon, Inc.

    1,994
    PX-68LCC

    规格书

    PX Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-84LCC

    PX-84LCC

    LEADLESS CHIP CARRIER 84P PBT RO

    Kycon, Inc.

    4,688
    PX-84LCC

    规格书

    PX Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    2255-929A-90-2401

    2255-929A-90-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    4,461
    2255-929A-90-2401

    规格书

    - Bulk Obsolete - - - - - - - - - - - - - - -
    2320-9220-02-2401

    2320-9220-02-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    3,241
    2320-9220-02-2401

    规格书

    - Bulk Obsolete - - - - - - - - - - - - - - -
    2432-9235-01-2401

    2432-9235-01-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    1,823
    2432-9235-01-2401

    规格书

    - Bulk Obsolete - - - - - - - - - - - - - - -
    2256-6321-9UA-1902

    2256-6321-9UA-1902

    GRID ZIP 21 X 21

    3M

    2,394
    2256-6321-9UA-1902

    规格书

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 256 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    276-6321-9UA-1902

    276-6321-9UA-1902

    TEST BURN-IN PGA

    3M

    1,498
    276-6321-9UA-1902

    规格书

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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